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H5PS1G63JFR-S6I

Part No H5PS1G63JFR-S6I
Manufacturer Hynix Semiconductor
Catalog DDR
Description DDR2-800 64Mx16 Ind
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 942265-H5PS1G63JFR-S6I
Series *
Ultra Librarian 3D Model Ultra Librarian H5PS1G63JFR-S6I CAD Model

Description

The H5PS1G63JFR-S6I is a DDR3 SDRAM (Synchronous Dynamic Random-Access Memory) chip manufactured by Hynix Semiconductor. This memory component is designed for applications that require high bandwidth and low latency, making it suitable for use in graphics cards, embedded systems, and various computing devices.

Applications

  • Graphics Cards
  • Embedded Systems
  • Gaming Consoles
  • Set-Top Boxes
  • Industrial PCs

Features

  • Capacity: Typically 1Gb (Gigabit)
  • DDR3 Technology: Uses DDR3 technology for increased speed and efficiency compared to older DDR generations.
  • Data Transfer Rate: Supports high data transfer rates, in accordance with JEDEC standards.
  • Operating Voltage: Operates at a low voltage (typically 1.5V or 1.35V) to minimize power consumption.
  • Interface: Standard DDR3 interface for broad compatibility.
  • RoHS Compliant: Manufactured in compliance with RoHS standards for environmental protection.
  • FBGA Package: Employs a fine-pitch ball grid array (FBGA) package for enhanced thermal performance and simplified mounting.

Benefits

  • High Performance: Enables faster data processing and enhances system responsiveness.
  • Low Power Consumption: Reduces energy usage and heat generation.
  • Increased Bandwidth: Offers higher bandwidth for demanding applications such as graphics processing, video editing, and data analysis.
  • Reliability: Designed for stable and reliable operation in various environmental conditions.
  • Compatibility: Compatible with a wide range of DDR3-supported platforms.

Additional Details

The H5PS1G63JFR-S6I DDR3 SDRAM chip is constructed using high-quality components and undergoes thorough testing to ensure reliability and optimal performance. It is designed to meet the demanding requirements of modern computing applications. For detailed specifications on timings and speed grades, refer to the product datasheet. The chip's architecture facilitates simultaneous read and write operations, further enhancing its performance capabilities. Furthermore, on-die termination (ODT) is incorporated to enhance signal integrity and minimize reflections.

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