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H5DU5182ETR-J3CR

Part No H5DU5182ETR-J3CR
Manufacturer Hynix Semiconductor
Catalog DDR
Description DDR-333 64Mx8 TSOP (512Mb)
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 944266-H5DU5182ETR-J3CR
Series *
Ultra Librarian 3D Model Ultra Librarian H5DU5182ETR-J3CR CAD Model

Description

The Hynix Semiconductor H5DU5182ETR-J3CR is a high-performance DDR (Double Data Rate) SDRAM (Synchronous Dynamic Random-Access Memory) component. This memory chip is designed for applications demanding substantial bandwidth and low latency data access, making it suitable for a wide array of computing and embedded systems. Specifically, the H5DU5182ETR-J3CR provides a combination of high density and speed, essential for modern electronic devices.

Applications:

  • High-performance computing systems
  • Graphics cards
  • Gaming consoles
  • Networking equipment
  • Embedded systems requiring high bandwidth memory

Features:

  • High-speed DDR interface
  • Low power consumption
  • High density memory storage
  • Optimized for demanding data processing applications
  • Advanced packaging for improved thermal performance

Benefits:

  • Increased system performance due to faster data access
  • Reduced power consumption leading to longer battery life in portable devices
  • Enhanced reliability due to robust design and manufacturing processes
  • Improved overall system efficiency
  • Cost-effective solution for high-performance memory requirements

The H5DU5182ETR-J3CR is designed to meet the rigorous demands of modern computing environments. Its high-speed interface ensures rapid data transfer, which is critical for applications such as video processing, gaming, and scientific simulations. The low power consumption feature helps to reduce energy costs and extends the operational life of battery-powered devices. The high density memory storage allows for the efficient handling of large datasets. The advanced packaging technology employed in the H5DU5182ETR-J3CR improves its thermal performance, ensuring stable operation even under heavy workloads.

Technical Specifications (Typical):

  • Density: Varies depending on specific configuration
  • Data Rate: Optimized for high-speed operation
  • Operating Voltage: Standard DDR voltage levels
  • Operating Temperature: Industrial temperature range
  • Package Type: Advanced packaging for thermal efficiency

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