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H5AN8G6NCJR-UHC

Part No H5AN8G6NCJR-UHC
Manufacturer Hynix Semiconductor
Catalog DDR
Description DDR4-2400 512Mx16 (8Gb)
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 940176-H5AN8G6NCJR-UHC
Series *
Ultra Librarian 3D Model Ultra Librarian H5AN8G6NCJR-UHC CAD Model

Description

The H5AN8G6NCJR-UHC is a high-performance DDR4 SDRAM (Synchronous Dynamic Random-Access Memory) module manufactured by Hynix Semiconductor. This memory module is designed for applications demanding high bandwidth and low latency, making it suitable for use in various computing environments, including desktops, laptops, servers, and embedded systems.

Applications

  • Desktop PCs
  • Laptop Computers
  • Server Systems
  • Networking Equipment
  • Embedded Systems

Features

  • Capacity: Typically 8Gb (Gigabits)
  • DDR4 Technology: Utilizes DDR4 technology for increased speed and efficiency compared to previous DDR generations.
  • Data Transfer Rate: High data transfer rates, supporting various JEDEC standard speeds.
  • Operating Voltage: Low operating voltage (typically 1.2V) for reduced power consumption.
  • Interface: Standard DDR4 interface for compatibility with a wide range of systems.
  • RoHS Compliant: Manufactured in compliance with RoHS standards for environmental protection.
  • FBGA Package: Utilizes a fine-pitch ball grid array (FBGA) package for efficient board mounting and thermal performance.

Benefits

  • High Performance: Enables faster data processing and improved system responsiveness.
  • Low Power Consumption: Reduces energy usage and heat generation, contributing to longer battery life in portable devices.
  • Increased Bandwidth: Provides higher bandwidth for demanding applications such as gaming, video editing, and data analysis.
  • Reliability: Designed for stable and reliable operation in various environmental conditions.
  • Compatibility: Compatible with a wide range of DDR4-supported platforms.

Additional Details

The H5AN8G6NCJR-UHC DDR4 SDRAM module is constructed using high-quality components and undergoes rigorous testing to ensure reliability and performance. It is designed to meet the demanding requirements of modern computing applications. Specific timings and speed grades vary, so refer to the product datasheet for detailed specifications. The module's architecture allows for simultaneous read and write operations, further enhancing its performance capabilities. The module also incorporates on-die termination (ODT) to improve signal integrity and reduce reflections.

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