The H5AN4G4NMFR-UHC is a 4Gb DDR4 SDRAM component manufactured by Hynix Semiconductor. It is designed for high-performance memory applications, offering increased bandwidth and reduced power consumption compared to previous DDR generations.

Applications:

• Desktop PCs
• Laptop PCs
• Servers
• Networking equipment
• Embedded systems

Features:

• 4Gb (512M x 8) memory organization
• DDR4 interface with data rates up to 2400 MT/s (Mega Transfers per Second) and beyond
• Operating voltage of 1.2V
• Lead-free and RoHS compliant
• On-die termination (ODT) for improved signal integrity

Benefits:

• Increased system performance due to high data transfer rates.
• Lower power consumption compared to DDR3, leading to improved energy efficiency.
• Improved signal integrity due to ODT, resulting in more reliable operation.
• Environmentally friendly due to lead-free and RoHS compliance.

Additional Details:

The H5AN4G4NMFR-UHC DDR4 SDRAM is designed to meet the demanding requirements of modern computing systems. It offers a significant improvement in performance and power efficiency compared to previous generations of DDR memory. The 4Gb density provides ample memory capacity for a wide range of applications. The DDR4 interface allows for faster data transfer rates, enabling smoother multitasking and improved responsiveness. The 1.2V operating voltage reduces power consumption, making it ideal for mobile and energy-sensitive applications. The on-die termination feature helps to improve signal integrity by reducing reflections and crosstalk. This results in a more stable and reliable system. The component is also lead-free and RoHS compliant, ensuring that it meets environmental regulations.

In specific terms, the UHC speed bin typically indicates a specific timing and frequency grade within the DDR4 specification. Further datasheet analysis provides precise timings such as CAS latency (CL), tRCD, and tRP, which are crucial for system integration. The FBGA package contributes to efficient thermal management and allows for high-density mounting on PCBs.