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Same model may have multiple batches, images only for reference.
GD25LT256EBIRY Real Image
Same model may have multiple batches, images only for reference.

GD25LT256EBIRY

Part No GD25LT256EBIRY
Manufacturer GigaDevice Semiconductor
Catalog Unclassified Memory
Description IC FLSH 256MBIT SPI/QUAD 24TFBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Categories Integrated Circuits (ICs)
Estimated Pruduction Lead Time 19 Weeks
Features FLASH - NOR Memory IC 256Mb (32M x 8) SPI - Quad I/O, QPI, DTR 200 MHz 24-TFBGA (6x8)
Manufacturer GigaDevice Semiconductor
Package Tray
Operating Temperature Range -40°C ~ 85°C (TA)
Mounting Surface Mount
Package 24-TBGA
Case / Package 24-TFBGA (6x8)
Family Name GD25LT256
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.32.0071
Other Part Number 1970-GD25LT256EBIRY, 1970-1091-2-ND, 1970-1091-1-ND, 1970-1091-1, 1970-1091-6INACTIVE, 1970-1091-2, 1970-1091-1INACTIVE, 1970-1091-6, 1970-1091-6-ND
Quantity per package 4800
Popularity High
Supply and Demand Status Balance
Win Source Part Number 919579-GD25LT256EBIRY
Ultra Librarian 3D Model Ultra Librarian GD25LT256EBIRY CAD Model

Description

The GigaDevice Semiconductor electronic component with Win Source Part Number 919579-GD25LT256EBIRY is an excellent product for those in need of a high-quality memory IC.

  • Product Name: 919579-GD25LT256EBIRY
  • Manufacturer: GigaDevice Semiconductor
  • Type: FLASH-NOR memory IC
  • Memory: 256Mb (32M x 8)
  • Interface: SPI-Quad I/O, QPI, DTR 200 MHz
  • Package: 24-TFBGA (6x8)
  • Family: GD25LT256
  • Popularity: High
  • Package Size: 4800
  • Estimated Production Lead Time: 19 weeks

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