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FDS7766NL

Part No FDS7766NL
Manufacturer Fairchild/ON Semiconductor
Catalog OEM Parts (F - I)
Sample
Rohs State Need to verify
ECAD Module
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Products specifications Report Issue?

RoHS Non-Compliant
Win Source Part Number 1058951-FDS7766NL
Categories OEM Parts(F-I)
Manufacturer Fairchild/ON Semiconductor
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian FDS7766NL CAD Model

Description

The FDS7766NL is an N-Channel PowerTrench® MOSFET manufactured by Fairchild Semiconductor, now part of ON Semiconductor. It is designed for high-efficiency power switching applications, particularly in synchronous rectification. Its low on-resistance (RDS(on)) and fast switching speed minimize power losses and enhance thermal performance.

Applications

  • Synchronous rectification in DC-DC converters
  • Power management in portable devices
  • Motor control
  • Load switching
  • Battery management systems

Features

  • Low on-resistance (RDS(on)) for minimal conduction losses
  • Fast switching speed for efficient power conversion
  • High current capability
  • Logic level gate drive
  • RoHS compliant

Benefits

  • Improved power efficiency in DC-DC converters
  • Reduced heat generation
  • Simplified design and layout
  • Enhanced system reliability
  • Environmentally friendly

Additional Details

The FDS7766NL is typically available in a surface-mount package, such as a Power33. The low RDS(on) minimizes voltage drop and power dissipation during conduction. The fast switching speed minimizes switching losses, improving overall efficiency. The logic-level gate drive simplifies gate drive circuitry. Refer to the datasheet for comprehensive details on static and dynamic characteristics, thermal resistance, and safe operating area to ensure optimal performance and reliability. Important electrical characteristics to consider are drain-source voltage (VDS), continuous drain current (ID), gate-source voltage (VGS), gate charge (Qg), and on-resistance at different gate voltages.

Proper thermal management is crucial for ensuring reliable operation and preventing overheating, especially in high-power applications. Heatsinking or forced-air cooling may be required. Design considerations should include minimizing parasitic inductance and capacitance through appropriate layout techniques to further enhance switching performance and reduce ringing.

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