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Same model may have multiple batches, images only for reference.
CY7C2262XV18-450BZXC Real Image
Same model may have multiple batches, images only for reference.

CY7C2262XV18-450BZXC

Part No CY7C2262XV18-450BZXC
Manufacturer Cypress Semiconductor Corp
Catalog SRAM
Description IC SRAM 36MBIT PARALLEL 165FBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Categories Integrated Circuits (ICs)
Estimated Pruduction Lead Time 39 Weeks
Features SRAM - Synchronous, QDR II+ Memory IC 36Mb (2M x 18) Parallel 450 MHz 165-FBGA (13x15)
Manufacturer Cypress Semiconductor Corp
Package Tray
Operating Temperature Range 0°C ~ 70°C (TA)
Mounting Surface Mount
Package 165-LBGA
Case / Package 165-FBGA (13x15)
Family Name CY7C2262
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B2A
HTSUS 8542.32.0041
Other Part Number CY7C2262XV18450BZXC, -CY7C2262XV18-450BZXC
Quantity per package 136
Popularity High
Supply and Demand Status Balance
Win Source Part Number 916462-CY7C2262XV18-450BZXC
Ultra Librarian 3D Model Ultra Librarian CY7C2262XV18-450BZXC CAD Model

Description

The Cypress Semiconductor Corp CY7C2262XV18-450BZXC is a synchronous, QDR II+ SRAM memory IC with a volatile memory type and a memory size of 36Mb (2M x 18).

  • Interface: Parallel interface and a maximum frequency of 450 MHz
  • Operating Temperature: 0°C to 70°C (TA)
  • Package: 165-LBGA package
  • Supply and Demand: Balanced
  • Lead Time: Estimated production lead time is 39 weeks
  • REACH: REACH unaffected
  • ECCN: 3A991B2A

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