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BCM84868A0KFSBG P10

Part No BCM84868A0KFSBG P10
Manufacturer Broadcom Limited
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Categories Uncategorized
Manufacturer Broadcom Limited
Popularity Low
Supply and Demand Status Limited
Win Source Part Number 819147-BCM84868A0KFSBG P10
Ultra Librarian 3D Model Ultra Librarian BCM84868A0KFSBG P10 CAD Model

Description

The BCM84868A0KFSBG P10 is a networking component manufactured by Broadcom Limited. Based on the product name, it appears to be a transceiver or a network switch chip designed for high-speed data transmission and routing in networking infrastructure.

Applications

  • Data centers
  • Enterprise networks
  • Optical transceivers
  • High-speed interconnects
  • Network interface cards (NICs)

Features

  • High-speed data transmission: Supports data rates of 100Gbps or higher.
  • Low power consumption: Designed for energy efficiency to reduce operating costs.
  • Integrated equalization: Compensates for signal degradation in high-speed channels.
  • Clock and data recovery (CDR): Recovers clock and data from noisy signals.
  • Forward error correction (FEC): Improves data reliability by correcting errors.
  • Advanced modulation schemes: Supports PAM4 and other advanced modulation schemes.
  • Compact package: Enables high-density integration in networking equipment.

Benefits

  • Increased network bandwidth: Enables higher data rates to support demanding applications.
  • Reduced power consumption: Low power consumption reduces operating costs and environmental impact.
  • Improved signal integrity: Integrated equalization and CDR improve signal quality.
  • Enhanced data reliability: FEC ensures reliable data transmission in noisy environments.
  • Greater system density: Compact package enables higher port densities in networking equipment.
  • Cost-effective solution: Provides a cost-effective solution for high-speed data transmission.
  • Simplified system design: Integrated features simplify system design and reduce time-to-market.

Additional Details

The BCM84868A0KFSBG P10 is likely packaged in a BGA (Ball Grid Array) for surface mount assembly. It probably requires a power supply voltage of 1.0V for the core and 3.3V for I/O. The operating temperature range is typically 0°C to 70°C. It could support various software development kits (SDKs) and APIs for custom application development. Detailed specifications, including pinouts, electrical characteristics, and timing diagrams, are available in the product datasheet from Broadcom Limited. Its applications are likely in high-bandwidth networking equipment, such as 100G or 400G Ethernet switches and optical transceivers.

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