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XCVU13P-2FHGB2104E

Part No XCVU13P-2FHGB2104E
Manufacturer Amd
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 702 I/O 2104FCBGA  /  series Field Programmable Gate Array (FPGA) IC 702 514867200 3780000 2104-BBGA, FCBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded - FPGAs (Field Programmable Gate Array)
Mfr AMD Xilinx
Series Virtex® UltraScale+™
Package Tray
Number of LABs/CLBs 216000
Number of Logic Elements/Cells 3780000
Total RAM Bits 514867200
Number of I/O 702
Voltage - Supply 0.825V ~ 0.876V
Mounting SMD (SMT)
Temperature Range - Operating 0°C ~ 100°C (TJ)
Package / Case 2104-BBGA, FCBGA
Supplier Device Package 2104-FCBGA (52.5x52.5)
Base Product Number XCVU13
MSL Level 4 (72 Hours)
ECCN 3A001A7B
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1014490-XCVU13P-2FHGB2104E
Ultra Librarian 3D Model Ultra Librarian XCVU13P-2FHGB2104E CAD Model

Description

The XCVU13P-2FHGB2104E is a Virtex UltraScale+ FPGA from AMD (formerly Xilinx). These high-performance FPGAs are designed for demanding applications requiring high bandwidth, high logic density, and advanced features. They are commonly used in data centers, networking infrastructure, and high-performance computing systems.

Applications

  • Data Centers: Accelerating workloads such as machine learning, data analytics, and video processing.
  • Networking Infrastructure: Implementing high-speed packet processing, traffic management, and security functions.
  • High-Performance Computing: Accelerating scientific simulations, financial modeling, and other computationally intensive tasks.
  • Aerospace and Defense: Implementing advanced signal processing, radar systems, and image processing algorithms.
  • Medical Imaging: Accelerating image reconstruction and analysis in medical imaging equipment.

Features

  • UltraScale+ Architecture: Advanced FPGA architecture with high logic density and performance.
  • Logic Cells: High number of logic cells for implementing complex designs.
  • DSP Slices: Dedicated digital signal processing (DSP) slices for high-performance signal processing.
  • Block RAM: Large amounts of on-chip block RAM for data storage and processing.
  • High-Speed Transceivers: High-speed transceivers for interfacing with external devices at high data rates.
  • Memory Interfaces: Support for various memory interfaces, such as DDR4 and HBM2.
  • Package: FHGB2104 package.

Benefits

  • High Performance: Delivers high-performance computing capabilities for demanding applications.
  • High Bandwidth: Provides high bandwidth for data transfer and processing.
  • Flexibility: Allows for custom hardware acceleration of specific workloads.
  • Scalability: Can be scaled to meet the growing demands of modern applications.
  • Power Efficiency: Offers a balance of performance and power efficiency.

Additional Details

The XCVU13P-2FHGB2104E is programmed using AMD's Vivado Design Suite. This comprehensive tool suite provides a complete environment for designing, simulating, and implementing FPGA designs. Proper design techniques, timing constraints, and power management strategies are essential to achieve optimal performance and reliability. The datasheet provides detailed information on device characteristics, timing parameters, and power consumption.

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Pricing & Ordering

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1+ $1,940.2986 $1,940.2986
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