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Category Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Mfr AMD Xilinx
Series Zynq®-7000
Package Tray
Product Status Obsolete
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz
Primary Attributes Kintex™-7 FPGA, 350K Logic Cells
Temperature Range - Operating 0°C ~ 85°C (TJ)
Package / Case 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)
Number of I/O 130
Base Product Number XC7Z045
MSL Level 4 (72 Hours)
ECCN 3A991D
HTSUS 8542.39.0001
Other Names 2266-XC7Z045-2FBG676CES,122-1829
Standard Package 1
Win Source Part Number 1105704-XC7Z045-2FBG676CES
Ultra Librarian 3D Model Ultra Librarian XC7Z045-2FBG676CES CAD Model

Description

The XC7Z045-2FBG676CES from AMD Xilinx is an embedded-system-on-chip (SoC) product that belongs to the Zynq-7000 series.

  • Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight
  • Core Processor Speed: 800MHz
  • MSL Level: 4
  • Package: Tray
  • I/Os: 130
  • RAM Size: 256KB
  • Manufacturer: AMD Xilinx
  • Win Source Part Number: 1105704-XC7Z045-2FBG676CES

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