XC7Z035-2FBG676E Real Image
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Category Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Mfr AMD Xilinx
Series Zynq®-7000
Package Tray
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz
Primary Attributes Kintex™-7 FPGA, 275K Logic Cells
Temperature Range - Operating 0°C ~ 100°C (TJ)
Package / Case 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)
Number of I/O 130
Base Product Number XC7Z035
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1025141-XC7Z035-2FBG676E
Ultra Librarian 3D Model Ultra Librarian XC7Z035-2FBG676E CAD Model

Description

This electronic component is a System on Chip (SoC) with a Win Source Part Number of 1025141-XC7Z035-2FBG676E.

  • Series: Zynq-7000
  • Core Processor: Dual ARM Cortex-A9 MPCore™ with CoreSight™
  • Speed: 800MHz
  • Package: Tray
  • Standard Package: 1
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG
  • Peripherals: DMA
  • I/Os: 130
  • RAM Size: 256KB
  • FPGA: Kintex-7 FPGA with 275K logic cells
  • Package/Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)

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Pricing & Ordering

Quantity Unit Price Ext. Price
1+ $330.4698 $330.4698
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
Availability: 650 pieces
Order Increment : 1 piece
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