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Category Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Mfr AMD Xilinx
Series Zynq®-7000
Package Tray
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 1GHz
Primary Attributes Kintex™-7 FPGA, 125K Logic Cells
Temperature Range - Operating 0°C ~ 100°C (TJ)
Package / Case 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)
Number of I/O 130
Base Product Number XC7Z030
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1009028-XC7Z030-3FFG676E
Ultra Librarian 3D Model Ultra Librarian XC7Z030-3FFG676E CAD Model

Description

The XC7Z030-3FFG676E is a system-on-chip (SoC) integrated circuit manufactured by AMD Xilinx.

  • Device Series: Zynq-7000
  • Processor: dual ARM Cortex-A9 MPCore processor with CoreSight
  • Speed: 1GHz
  • RAM size: 256kB
  • ECCN: 3A991D
  • Market Popularity: low
  • Supply: limited

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Pricing & Ordering

Quantity Unit Price Ext. Price
1+ $175.7576 $175.7576
2+ $157.5758 $315.1516
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
Availability: 1,588 pieces
Order Increment : 1 piece
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