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XC17S30XLPDG8C

Part No XC17S30XLPDG8C
Manufacturer Amd
Catalog Memory - Configuration Proms for FPGAs
Description IC PROM PROG C-TEMP 3.3V 8-DIP
Sample
Rohs State Need to verify
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs) - Memory - Configuration Proms for FPGAs
Mfr AMD
Package Tube
Product Status Obsolete
Programmable Not Verified
Programmable Type OTP
Memory Size 300kb
Voltage - Supply 3V ~ 3.6V
Temperature Range - Operating 0°C ~ 70°C
Mounting Type Through Hole
Package / Case 8-DIP (0.300", 7.62mm)
Supplier Device Package 8-PDIP
Base Product Number XC17S30XL
Standard Package 50 pcs
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.32.0061
Win Source Part Number 903538-XC17S30XLPDG8C
Ultra Librarian 3D Model Ultra Librarian XC17S30XLPDG8C CAD Model

Description

The XC17S30XLPDG8C is an integrated circuit memory configuration PROM designed for use with FPGAs manufactured by AMD.

  • Memory Size: 300kb
  • Voltage Supply: 3V to 3.6V
  • Package: 8-DIP
  • Mounting: Through-Hole
  • Temperature Range: 0°C to 70°C
  • Package Quantity: 50 pieces
  • ECCN: EAR99
  • Fake Product Threat: 34%

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Pricing & Ordering

Quantity Unit Price Ext. Price
1+ $536.2500 $536.2500
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Availability: 400 pieces
Order Increment : 1 pcs
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