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XCZU4CG-1FBVB900I

Part No XCZU4CG-1FBVB900I
Manufacturer Xilinx Inc.
Catalog Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A53 900FCBGA / Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 192K+ Logic Cells 500MHz, 1.2GHz 900-FCBGA (31x31)
Sample
Rohs State rohs
ECAD Module
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Category Integrated Circuits (ICs)>Embedded>System On Chip (SoC)
Manufacturer AMD Xilinx
Packaging Tray
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Temperature Range - Operating -40°C ~ 100°C (TJ)
Case / Package 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
Number of I/O 204
Base Product Number XCZU4
RoHS Status ROHS3 Compliant
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1323238-XCZU4CG-1FBVB900I
Ultra Librarian 3D Model Ultra Librarian XCZU4CG-1FBVB900I CAD Model

Description

The AMD Xilinx 1323238-XCZU4CG-1FBVB900I is a Zynq®UltraScale+™ FPGA with 192K+ logic cells.

  • Core Processor: dual ARM® Cortex®-A53 MPCore™ with CoreSight™, dual ARM®Cortex™-R5 with CoreSight™
  • Speed: 500MHz, 1.2GHz
  • I/O: 204
  • RAM Size: 256KB
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripherals: DMA, WDT
  • Package: 900-FCBGA (31x31)
  • Temperature Range: -40°C ~ 100°C (TJ)
  • ROHS3 Compliance: ROHS3

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Pricing & Ordering

Quantity Unit Price Ext. Price
1+ $191.8797 $191.8797
2+ $172.0301 $344.0602
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Availability: 958 pieces
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