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Same model may have multiple batches, images only for reference.
XC7Z100-L2FFG1156I Real Image
Same model may have multiple batches, images only for reference.

XC7Z100-L2FFG1156I

Part No XC7Z100-L2FFG1156I
Manufacturer Xilinx Inc.
Catalog Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A9 800MHZ 1156BGA / Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 444K Logic Cells 800MHz 1156-FCBGA (35x35)
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded>System On Chip (SoC)
Manufacturer AMD Xilinx
Packaging Tray
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz
Primary Attributes Kintex™-7 FPGA, 444K Logic Cells
Temperature Range - Operating -40°C ~ 100°C (TJ)
Case / Package 1156-BBGA, FCBGA
Supplier Device Package 1156-FCBGA (35x35)
Number of I/O 130
Base Product Number XC7Z100
RoHS Status ROHS3 Compliant
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1318039-XC7Z100-L2FFG1156I
Ultra Librarian 3D Model Ultra Librarian XC7Z100-L2FFG1156I CAD Model

Description

The XC7Z100-L2FFG1156I is a system on chip (SoC) manufactured by AMD Xilinx.

  • Processor: dual ARM® Cortex®-A9 MPCore™ with CoreSight™ @ 800MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG
  • Peripherals: DMA
  • I/Os: 130
  • RAM Size: 256KB
  • FPGA: Kintex™-7 FPGA with 444K logic cells
  • Package: 1156-FCBGA (35x35)
  • Operating Temperature: -40°C to 100°C
  • MSL: 4 (72 Hours)
  • HTSUS Code: 8542.39.0001

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