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XCZU9EG-1FFVB1156I

Part No XCZU9EG-1FFVB1156I
Manufacturer Xilinx Inc.
Catalog Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A53 1156FCBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Manufacturer Xilinx Inc.
Packaging Tray
Architecture MCU, FPGA
Core Processor Quad ARM Cortex -A53 MPCore with CoreSight , Dual ARM Cortex -R5 with CoreSight , ARM Mali -400 MP2
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 600MHz, 1.2GHz
Primary Attributes Zynq UltraScale+ FPGA, 599K+ Logic Cells
Temperature Range - Operating -40°C ~ 100°C
Manufacturer Package 1156-BBGA, FCBGA
Supplier Device Package 1156-FCBGA (35x35)
Number of I/O 328
Manufacturer Pack Quantity 1
MSL Level 4 (72 Hours)
Popularity Low
Supply and Demand Status Limited
Win Source Part Number 813414-XCZU9EG-1FFVB1156I
Ultra Librarian 3D Model Ultra Librarian XCZU9EG-1FFVB1156I CAD Model

Description

The Xilinx Inc. XCZU9EG-1FFVB1156I is a powerful and versatile integrated circuit (IC) designed for microcontroller unit (MCU) and field-programmable gate array (FPGA) architectures. The device has a quad ARM Cortex-A53 MPCore with CoreSight, dual ARM Cortex-R5 with CoreSight, and ARM Mali-400 MP2 core processors.

  • Processors: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight, ARM Mali-400 MP2 core
  • Speed: 500 MHz, 600 MHz, 1.2 GHz
  • Interfaces: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • I/O Pins: 328
  • RAM: 256 KB
  • Package: 1156-ball fine-pitch ball grid array (FCBGA)
  • Package Size: 35x35 mm
  • Packaging: Tray
  • Manufacturer Pack Quantity: 1
  • MSL Level: 4 (72 hours)

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Pricing & Ordering

Quantity Unit Price Ext. Price
1+ $873.1344 $873.1344
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Availability: 300 pieces
Order Increment : 1 pcs
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