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XC4VFX100-12FFG1152C

Part No XC4VFX100-12FFG1152C
Manufacturer Xilinx Inc.
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description FPGA Virtex®-4 FX Family 94896 Cells 90nm (CMOS) Technology 1.2V 1152-Pin FCBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Mounting SMD (SMT)
Case / Package FCBGA
Maximum Operating Temperature 85 °C
Min Operating Temperature 0 °C
Mount Surface Mount
Number of I/Os 576
Number of Logic Blocks (LABs) 10544
Number of Logic Elements/Cells 94896
Number of Pins 1152
Operating Supply Voltage 1.2 V
Radiation Hardening No
RAM Size 846 kB
RoHS Compliant
Speed Grade 12
Win Source Part Number 1027373-XC4VFX100-12FFG1152C
Categories Embedded - FPGAs(Field Programmable GateArray)
Manufacturer Xilinx Inc.
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian XC4VFX100-12FFG1152C CAD Model

Description

The XC4VFX100-12FFG1152C is a high-performance Virtex-4 FX series Field Programmable Gate Array (FPGA) from Xilinx. This FPGA is designed for demanding applications requiring significant processing power, high-speed connectivity, and advanced features.

Applications

  • Aerospace and Defense: Radar processing, image processing, and high-speed data acquisition systems.
  • Wireless Communications: Baseband processing, software-defined radio (SDR), and channel coding.
  • Wired Communications: High-speed networking equipment, data center switches, and routers.
  • Medical Imaging: Real-time image processing for MRI, CT scans, and ultrasound.
  • Industrial Automation: Machine vision, motor control, and robotics.

Features

  • Logic Cells: Contains a large number of logic cells for implementing complex digital circuits.
  • Memory Resources: Includes embedded block RAM for on-chip data storage and manipulation.
  • DSP Slices: Equipped with dedicated DSP slices for high-performance digital signal processing.
  • PowerPC Processors: Incorporates embedded PowerPC processors for system-level control and processing tasks.
  • High-Speed I/O: Supports a wide range of high-speed I/O standards for connectivity with external devices.
  • Advanced Interconnect: Features a flexible and high-bandwidth interconnect architecture for efficient data routing.
  • Package: Available in a 1152-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG1152) package.

Benefits

  • High Performance: Delivers exceptional performance for demanding applications, thanks to its advanced architecture and high-speed I/O.
  • Flexibility: Offers a high degree of flexibility, allowing designers to implement custom logic circuits and algorithms.
  • Integration: Integrates a wide range of features, including logic cells, memory resources, DSP slices, and PowerPC processors, reducing the need for external components.
  • Power Efficiency: Provides optimized power consumption for power-sensitive applications.
  • Time-to-Market: Enables rapid prototyping and development, reducing time-to-market for new products.

Additional Details

The XC4VFX100-12FFG1152C operates at a high speed grade (-12), ensuring fast and reliable performance. It is fabricated using advanced process technology, providing excellent power efficiency and reliability. The device supports various configuration options, allowing designers to tailor the device to their specific requirements. It is a complex device that can handle a wide range of applications because of its memory, logic capacity, and I/O capabilities.

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