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XC3S1500-FG676C

Part No XC3S1500-FG676C
Manufacturer Xilinx Inc.
Catalog Embedded - FPGAs (Field Programmable Gate Array)
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Category Integrated Circuits(ICs)
Family Embedded - FPGAs(Field Programmable GateArray)
Manufacturer Xilinx Inc.
Win Source Part Number 412654-XC3S1500-FG676C
Popularity Low
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian XC3S1500-FG676C CAD Model

Description

The XC3S1500-FG676C is a Field-Programmable Gate Array (FPGA) belonging to the Spartan-3 family manufactured by Xilinx. This FPGA is designed to offer a balance of performance, features, and cost, making it suitable for a wide variety of digital applications. It provides a flexible platform for custom hardware implementation, enabling designers to create tailored solutions for specific needs.

Applications

  • Digital Signal Processing (DSP): Used for implementing custom DSP algorithms, such as filtering, transforms, and modulation/demodulation.
  • Telecommunications: Employed in baseband processing, channel coding, and protocol implementation in communication systems.
  • Instrumentation: Integrated into test and measurement equipment for signal generation, data acquisition, and analysis.
  • Aerospace and Defense: Utilized in radar systems, signal intelligence, and embedded control applications.
  • Medical Imaging: Applied in image processing and reconstruction in medical imaging devices.

Features

  • Logic Cells: Contains 33,192 logic cells, providing a large capacity for complex digital designs.
  • Distributed RAM: Features 576 Kbits of distributed RAM for fast on-chip memory access.
  • Block RAM: Includes 576 Kbits of block RAM for larger memory requirements and data buffering.
  • Multipliers: Equipped with 32 dedicated 18 x 18 multipliers for high-speed arithmetic operations.
  • Digital Clock Managers (DCMs): Offers flexible clock management and frequency synthesis capabilities.
  • I/O Pins: Provides 489 user I/O pins for interfacing with external devices and systems.
  • Package: Available in a 676-pin Fine-Pitch Ball Grid Array (FG676) package.
  • Operating Voltage: Core voltage of 1.2V for low power consumption.

Benefits

  • Flexibility: Allows for custom hardware implementation, enabling rapid prototyping and design modifications.
  • High Performance: Delivers high-speed processing capabilities for demanding applications.
  • Cost-Effectiveness: Provides a cost-optimized solution for custom digital logic implementation.
  • Integration: Integrates multiple functions into a single chip, reducing board space and system complexity.
  • Reconfigurability: Enables in-system reprogramming, allowing for design updates and feature enhancements without hardware changes.

Additional Details

The XC3S1500-FG676C is supported by Xilinx's ISE design suite, which provides a comprehensive set of tools for design entry, simulation, and implementation. The device's architecture includes configurable logic blocks (CLBs), which are the fundamental building blocks for implementing logic functions. The Spartan-3 family is known for its low static power consumption, making it suitable for battery-powered and energy-sensitive applications. The FG676 package provides a high pin count for extensive I/O connectivity and efficient thermal management. Its large logic capacity and high-speed multipliers make it well-suited for complex DSP and data processing applications.

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