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XC2V6000-5FF1152I

Part No XC2V6000-5FF1152I
Manufacturer Xilinx Inc.
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 824 I/O 1152FCBGA
Sample
Rohs State rohs
ECAD Module
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Categories Integrated Circuits (ICs)
Features series Field Programmable Gate Array (FPGA) IC 824 2654208 1152-BBGA, FCBGA
Manufacturer Xilinx Inc.
Series Virtex®-II
Package Tray
Part Status Obsolete
Number of I/O 824
Operating Temperature Range -40°C ~ 100°C (TJ)
Mounting Surface Mount
Package 1152-BBGA, FCBGA
Case / Package 1152-FCBGA (35x35)
Family Name XC2V6000
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 3A001A7A
HTSUS 8542.39.0001
Quantity per package 24
Popularity High
Supply and Demand Status Balance
Win Source Part Number 939262-XC2V6000-5FF1152I
Ultra Librarian 3D Model Ultra Librarian XC2V6000-5FF1152I CAD Model

Description

The XC2V6000-5FF1152I is a high-density FPGA from the Xilinx Virtex-II family, designed for demanding applications requiring substantial logic resources and high-speed performance. The 'FF1152' indicates a Flip-Chip package with 1152 pins, providing extensive I/O capabilities. The 'I' designates that this part is rated for the industrial temperature range.

Applications:

  • High-End Routers and Switches: Implemented for packet processing, traffic management, and quality of service (QoS) enforcement.
  • Advanced Image Processing Systems: Utilized in medical imaging, video surveillance, and machine vision applications for real-time analysis and enhancement.
  • Data Center Acceleration: Deployed in servers and storage systems to offload computationally intensive tasks, such as encryption and data compression.
  • Aerospace and Defense Systems: Used in radar processing, electronic warfare, and secure communication applications for high-speed signal processing and data encryption.
  • High-Performance Computing: Integrated into custom computing platforms for accelerating scientific simulations and financial modeling.

Features:

  • High Logic Density: Provides a large number of logic cells and configurable logic blocks (CLBs) for implementing complex digital designs.
  • Extensive On-Chip Memory: Includes embedded block RAM and distributed RAM for high-speed data storage and retrieval.
  • Advanced Clock Management: Features digital clock managers (DCMs) for precise clock generation and distribution.
  • Flexible I/O Connectivity: Supports a wide range of I/O standards and protocols, enabling seamless integration with external devices.
  • High-Speed Serial Transceivers: Incorporates RocketIO multi-gigabit transceivers for high-bandwidth serial communication.

Benefits:

  • Faster Development Cycles: Enables rapid prototyping and development of complex digital systems.
  • Increased System Performance: Delivers high-speed operation and optimized resource utilization.
  • Greater Design Flexibility: Offers a high degree of programmability and customization.
  • Reduced Power Consumption: Provides power optimization features to minimize energy usage.
  • Enhanced System Reliability: Ensures robust performance in harsh industrial environments.

Additional Details:

The XC2V6000-5FF1152I features 6,443,520 system gates and 241,920 logic cells. It includes distributed RAM of 2,488,320 bits. It provides 800 available I/O pins. The device operates at a core voltage of 1.5V. The speed grade is -5.

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