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WR06X683JTL

Part No WR06X683JTL
Manufacturer Walsin Technology Corporation
Catalog Chip Resistor - Surface Mount
Sample
Rohs State rohs
ECAD Module
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Manufacturer Walsin Technology Corporation
Popularity Low
Supply and Demand Status Balance
Win Source Part Number 842484-WR06X683JTL
Ultra Librarian 3D Model Ultra Librarian WR06X683JTL CAD Model

Description

The WR06X683JTL is a thick film chip resistor from Walsin Technology Corporation. It is a general-purpose resistor suitable for a broad range of electronic applications. This component provides stable resistance and reliable performance within typical operating conditions.

Applications

  • Current limiting for transistors and ICs
  • Feedback resistors in amplifier circuits
  • Voltage dividers for biasing circuits
  • Snubber circuits for transient voltage suppression
  • General-purpose resistance in various electronic circuits

Features

  • Compact 0603 Package: Measures 1.6mm x 0.8mm, ideal for space-constrained designs.
  • Thick Film Construction: Ensures stable resistance and reliable operation.
  • High Precision: Available with tight tolerance options for accurate circuit performance.
  • RoHS Compliance: Meets environmental regulations for lead-free components.
  • Wide Operating Temperature Range: Suitable for diverse environments.

Benefits

  • Miniaturization: Small footprint enables high-density PCB layouts.
  • Stable Resistance: Thick film technology provides consistent performance over time and temperature.
  • Easy Assembly: Designed for automated surface mount assembly processes.
  • Cost-Effective: Offers an economical solution for general-purpose resistance requirements.
  • Long-Term Reliability: Robust construction ensures extended operational lifespan.

Technical Specifications

The WR06X683JTL features a resistance value of 68k ohms with a tolerance of ±5%. The power rating is 0.1W (1/10W), with a maximum operating voltage typically around 50V. The temperature coefficient of resistance (TCR) typically is ±200 ppm/°C. The construction involves a ceramic substrate with a thick film resistive layer and a protective coating. The terminals are solder-plated for optimal surface mount connectivity.

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