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UTC3308L-S08-R

Part No UTC3308L-S08-R
Manufacturer UTC
Catalog HOT - SALES and EOL Components (U - Z)
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Manufacturer UTC
Win Source Part Number 396769-UTC3308L-S08-R
Popularity Low
Supply and Demand Status Balance
Ultra Librarian 3D Model Ultra Librarian UTC3308L-S08-R CAD Model

Description

The UTC3308L-S08-R is a low-voltage, low-power, dual operational amplifier (op-amp) from UTC (Unisonic Technologies Co., Ltd.), designed and packaged for efficient use in compact, surface-mount applications. This variant, indicated by the '-S08-R' suffix, specifies its packaging details, typically referring to an SOIC-8 (Small Outline Integrated Circuit, 8-pin) package with tape and reel packaging for automated assembly. This makes it ideal for high-volume manufacturing where space and efficiency are paramount. The core functionality remains similar to the standard UTC3308L, focusing on low-voltage operation and minimal power consumption.

Applications

  • Automated Assembly Circuits: Specifically designed for use in automated pick-and-place assembly lines.
  • High-Density Circuit Boards: Suitable for applications where board space is limited and surface-mount components are necessary.
  • Low-Voltage Audio Systems: Used in portable audio devices requiring low power consumption and compact design.
  • Sensor Signal Conditioning in Portable Devices: Employed in battery-powered sensor interfaces.
  • Wearable Technology: Found in devices like smartwatches and fitness trackers.

Features

  • Low Voltage Operation: Operates efficiently at low supply voltages, conserving power.
  • Low Power Consumption: Extends battery life in portable applications.
  • Low Input Bias Current: Minimizes errors in high-impedance circuits.
  • Low Offset Voltage: Provides accurate signal amplification.
  • SOIC-8 Package: Small Outline Integrated Circuit with 8 pins, optimized for surface-mount technology.
  • Tape and Reel Packaging (-R): Facilitates automated pick-and-place assembly.

Benefits

  • Efficient Assembly: Tape and reel packaging enables high-speed, automated manufacturing.
  • Space Saving: SOIC-8 package allows for dense component placement on circuit boards.
  • Extended Battery Life: Low power consumption is critical for portable devices.
  • Accurate Signal Processing: Low input bias current and offset voltage ensure precision.
  • Cost-Effective in High Volumes: Designed for efficient manufacturing processes, reducing overall costs.

Additional Details

The specifications for the UTC3308L-S08-R include parameters optimized for low-voltage, single-supply operation. The SOIC-8 package provides good thermal performance while maintaining a small footprint. The tape and reel packaging conforms to industry standards for automated assembly, ensuring compatibility with standard pick-and-place equipment. It is commonly used in mass-produced consumer electronics, industrial automation, and portable medical devices.

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