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74CB3T16211DGVRG4

Part No 74CB3T16211DGVRG4
Manufacturer Texas Instruments
Catalog Logic - Signal Switches, Multiplexers, Decoders
Description 24-BIT FET SWITCH 2.5-V/3.3-V LOW-VOLTAGE BUS SWITCH WITH 5-V-TOLERANT LEVEL SHIFTER
Sample
Rohs State rohs
ECAD Module
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Manufacturer Texas Instruments
Win Source Part Number 1131186-74CB3T16211DGVRG4
Manufacturer Homepage www.ti.com
Popularity Medium
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian 74CB3T16211DGVRG4 CAD Model

Description

The 74CB3T16211DGVRG4 is a high-performance integrated circuit designed and manufactured by Texas Instruments, a leader in semiconductor solutions. This product belongs to the family of bus switch ICs that are used to facilitate the switching of signals within a circuit without the propagation delays and power consumption associated with traditional mechanical switches.

Key Features

  • Low On-State Resistance: The device features a low on-state resistance, which allows for minimal signal distortion and ensures efficient signal transmission.
  • 5-V Tolerant Inputs and Outputs: This makes the chip compatible with a range of logic levels, providing design flexibility in mixed-voltage environments.
  • Low Power Consumption: The 74CB3T16211DGVRG4 is designed for low power operation, which is ideal for power-sensitive applications.
  • High-Speed Data Flow: The switch's fast switching speeds enable high-bandwidth data flow, making it suitable for high-speed data applications.
  • Wide Operating Temperature Range: It is designed to operate over a broad temperature range, ensuring reliability across various environmental conditions.

Applications

The 74CB3T16211DGVRG4 is versatile and can be used in a variety of applications, including:

  • Signal gating
  • Data switching and routing
  • Bus isolation and bus exchange
  • Peripheral sharing
  • Hot-swapping and hot-docking

Quality and Reliability

Texas Instruments is known for its commitment to quality and reliability. The 74CB3T16211DGVRG4 is no exception and is built to meet the rigorous standards expected of TI components. With its robust design and proven manufacturing process, this product is a reliable choice for critical applications where performance and uptime are paramount.

Package Information

The device comes in a TVSOP (Thin Shrink Small Outline Package) form factor, which is designed for space-saving on PCBs and is suitable for automated assembly processes. Its compact size and low profile make it an excellent choice for sleek, modern electronic products.

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