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533061-5

Part No 533061-5
Manufacturer TE Connectivity
Catalog Backplane Connectors
Description CONN HEADER HD 120POS PCB / 120 Connector Header, Male Pins Through Hole Black High Density (HDC, HDI, HPC)
Sample
Rohs State Need to verify
ECAD Module
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Products specifications Report Issue?

Category Connectors, Interconnects>Backplane Connectors - Specialized
Mfr TE Connectivity AMP Connectors
Series HDI (High Density Interconnect)
Package Tube
Connector Type Header, Male Pins
Connector Style High Density (HDC, HDI, HPC)
Number of Positions 120
Number of Positions Loaded All
Pitch 0.100" (2.54mm)
Number of Rows 3
Mounting Type Through Hole
Termination Press-Fit
Features Mating Guide
Contact Finish Gold
Contact Finish Thickness 30.0µin (0.76µm)
Color Black
Material Flammability Rating UL94 V-0
Temperature Range - Operating -65°C ~ 125°C
Base Product Number 533061
RoHS Status RoHS non-compliant
MSL Level 1 (Unlimited)
REACH Status REACH Affected
ECCN EAR99
HTSUS 8536.69.4040
Standard Package 160
Win Source Part Number 1031972-533061-5
Ultra Librarian 3D Model Ultra Librarian 533061-5 CAD Model

Description

The 533061-5 is a rectangular board-to-board connector manufactured by TE Connectivity. These connectors are designed to provide a reliable and efficient connection between two printed circuit boards (PCBs). They are essential components in electronic systems where modularity, ease of assembly, and signal integrity are critical.

Applications

  • Telecommunications Equipment: Used for interconnecting various modules within telecom systems, such as line cards and backplanes.
  • Industrial Automation: Employed in control systems, robotic interfaces, and sensor connections within industrial machinery.
  • Data Communications: Found in networking hardware like routers, switches, and servers for connecting PCBs that handle data transmission.
  • Medical Devices: Used in diagnostic equipment, patient monitoring systems, and imaging devices for secure and reliable PCB connections.
  • Consumer Electronics: Implemented in devices like computers, laptops, and gaming consoles for internal board connections.

Features

  • High Density: Offers a compact design allowing for a large number of connections in a small space.
  • Robust Construction: Manufactured with durable materials to withstand mechanical stress and environmental factors.
  • Reliable Contact Interface: Designed for secure and stable connections, minimizing signal loss and ensuring consistent performance.
  • Polarization: Features polarization to prevent incorrect mating, ensuring proper alignment and connection integrity.
  • Surface Mount Technology (SMT): Designed for automated assembly processes, enabling efficient and cost-effective manufacturing.

Benefits

  • Improved System Performance: Ensures reliable signal transmission, reducing the risk of data errors and system failures.
  • Simplified Assembly: Facilitates easy and quick assembly, reducing manufacturing time and costs.
  • Increased System Modularity: Allows for flexible system configurations and easy upgrades or repairs.
  • Enhanced Durability: Provides long-lasting performance in demanding environments, minimizing the need for replacements.
  • Compact Design: Enables the creation of smaller and more efficient electronic devices.

Additional Details

The 533061-5 connector typically features a specific pin count and pitch, depending on the application requirements. The housing material is often made of high-temperature thermoplastic, which can withstand soldering processes. The contacts are usually gold-plated to provide excellent conductivity and corrosion resistance. It's designed to meet industry standards for electrical and mechanical performance. Consult the TE Connectivity datasheet for precise specifications, including voltage and current ratings, operating temperature range, and mating force requirements.

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