The FW-08-02-G-D-189-075 is a Samtec Inc. connector, specifically a part of their FW series of fine-pitch, high-speed board-to-board connectors. It is designed for reliable, high-density interconnections in a variety of electronic applications. This connector features a surface mount design, facilitating automated assembly processes and contributing to miniaturization of electronic devices.

Applications:

• Board-to-board connections in tightly packed electronic systems.
• High-speed data transmission systems requiring signal integrity.
• Medical equipment requiring reliable and compact interconnects.
• Industrial control systems where robust connections are crucial.
• Telecommunications equipment for signal routing and distribution.

Features:

• Fine pitch design for high density packaging.
• Surface mount termination for automated assembly.
• Gold-plated contacts for superior conductivity and corrosion resistance.
• Double row configuration for increased pin count.
• Durable construction for reliable performance in demanding environments.

Benefits:

• Enables miniaturization of electronic devices.
• Provides reliable, high-speed data transmission.
• Reduces assembly costs through automated placement.
• Ensures long-term performance and reliability.
• Offers a robust and secure connection.

Additional Details:

The FW series from Samtec offers a variety of pin counts and stack heights to suit different application needs. The FW-08-02-G-D-189-075 part number specifies the following characteristics: FW series, 08 pins per row, 02 rows, Gold plating, Double row, 0.189 inch stack height, and 0.075 inch tail length. The connector body is typically made of high-temperature thermoplastic material suitable for reflow soldering processes. It's designed to mate with Samtec's SF series socket strips. The gold plating on the contacts ensures excellent conductivity and resistance to corrosion, contributing to long-term reliability and signal integrity. This connector is often used in applications where space is limited and high-performance interconnectivity is critical.