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K4T1G044QQ-HCF7

Part No K4T1G044QQ-HCF7
Manufacturer Samsung
Catalog DDR
Description DDR2-800 256Mx4
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 941913-K4T1G044QQ-HCF7
Series *
Ultra Librarian 3D Model Ultra Librarian K4T1G044QQ-HCF7 CAD Model

Description

The K4T1G044QQ-HCF7 is a 1Gb DDR2 SDRAM (Double Data Rate 2 Synchronous Dynamic Random-Access Memory) chip manufactured by Samsung. This memory component is designed for applications where high bandwidth and low latency are crucial, such as graphics processing, high-end computing, and advanced embedded systems.

Applications:

  • Graphics Cards
  • High-Performance Computing Systems
  • Advanced Embedded Systems
  • Gaming Consoles
  • Networking Equipment
  • Digital Video Recorders (DVRs)

Features:

  • 1Gb (128M x 8) memory configuration
  • DDR2 interface enabling double data rate operation
  • Data transfer rates up to 800 Mbps
  • Operating voltage: 1.8V
  • 8 internal banks for concurrent operation
  • Write latency of 0 or 1 clock cycles
  • 8-bit prefetch architecture
  • On-Die Termination (ODT) for improved signal integrity
  • RoHS compliant and lead-free

Benefits:

  • High memory bandwidth for demanding applications
  • Low operating voltage reducing power consumption
  • Improved system performance due to 8 internal banks allowing concurrent operations
  • Simplified system design using ODT
  • Environmentally friendly with RoHS compliance and lead-free construction

Additional Details:

The K4T1G044QQ-HCF7 uses an 8n prefetch architecture to facilitate high-speed data access. The inclusion of On-Die Termination (ODT) minimizes signal reflection and optimizes signal integrity, especially at higher data rates. It operates at a voltage of 1.8V, which contributes to reduced power consumption and heat dissipation. It features eight internal banks enabling concurrent operation, therefore, improving memory throughput and system responsiveness.

This component adheres to RoHS and lead-free standards, which aligns with environmental compliance initiatives. The K4T1G044QQ-HCF7 is typically packaged in a FBGA (Fine-pitch Ball Grid Array) configuration that supports ease of integration into a PCB layout. The chip is designed to meet the high-performance demands in graphics processing, high-end computing, and advanced embedded systems.

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