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71V416S12PHGI

Part No 71V416S12PHGI
Manufacturer Renesas Electronics America
Catalog SRAM
Description IC SRAM 4MBIT PARALLEL 44TSOP II
Sample
Rohs State rohs
ECAD Module
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Categories Integrated Circuits (ICs)
Estimated Pruduction Lead Time 19 Weeks
Features SRAM - Asynchronous Memory IC 4Mb (256K x 16) Parallel 44-TSOP II
Manufacturer Renesas Electronics America
Package Tube
Operating Temperature Range -40°C ~ 85°C (TA)
Mounting Surface Mount
Package 44-TSOP (0.400", 10.16mm Width)
Case / Package 44-TSOP II
Family Name 71V416
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B2A
HTSUS 8542.32.0041
Other Part Number IDT71V416S12PHGI, IDT71V416S12PHGI-ND, 800-2137
Quantity per package 26
Popularity High
Supply and Demand Status Balance
Win Source Part Number 907830-71V416S12PHGI
Ultra Librarian 3D Model Ultra Librarian 71V416S12PHGI CAD Model

Description

The Renesas 71V416S12PHGI is a high-speed, low-power asynchronous Static Random Access Memory (SRAM) device. It features a 4Mbit (256K x 16) organization, providing ample memory capacity for various embedded systems. The device is designed for applications demanding fast access times and minimal power consumption.

Applications

  • Networking equipment (routers, switches)
  • Industrial control systems
  • Medical devices
  • Test and measurement equipment
  • Data acquisition systems
  • Embedded processors with external memory requirements

Features

  • Fast access time (12ns)
  • Low power consumption
  • 4Mbit (256K x 16) memory organization
  • Single 3.3V power supply
  • TTL-compatible inputs and outputs
  • Available in a 44-pin TSOP (Thin Small Outline Package)

Benefits

  • Enables high-performance system operation
  • Reduces overall system power consumption
  • Provides sufficient memory capacity for demanding applications
  • Simplifies system design
  • Ensures compatibility with various logic families
  • Facilitates easy integration into surface-mount PCBs

Additional Details

The 71V416S12PHGI SRAM utilizes advanced CMOS technology for optimal performance. It supports standard asynchronous memory read and write operations. The device is typically used in conjunction with a memory controller or processor with external memory interface. Considerations for PCB layout include proper power supply decoupling and signal termination to minimize noise and ensure signal integrity. The operating temperature range and other environmental specifications should be verified in the product datasheet. Proper handling procedures should be followed to prevent electrostatic discharge (ESD) damage.

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