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HYB18T1G800CF-3S

Part No HYB18T1G800CF-3S
Manufacturer Qimonda
Catalog DDR
Description DDR2-667 128Mx8 FBGA
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 942026-HYB18T1G800CF-3S
Series *
Ultra Librarian 3D Model Ultra Librarian HYB18T1G800CF-3S CAD Model

Description

The HYB18T1G800CF-3S is a DDR2 SDRAM (Double Data Rate 2 Synchronous Dynamic Random-Access Memory) module manufactured by Qimonda. It is designed for use in a wide range of applications requiring high-speed memory access, including PCs, laptops, servers, and embedded systems. This particular module has a capacity of 1 Gigabit (1Gbit) organized as 128M x 8.

Applications:

  • Personal Computers (PCs): Used as system memory for desktop computers.
  • Laptops: Provides the main memory for portable computers.
  • Servers: Used in server systems for handling large amounts of data.
  • Embedded Systems: Integrated into embedded devices requiring significant memory capacity.
  • Graphics Cards: May be used as memory on older graphics cards.

Features:

  • DDR2 Technology: Offers improved performance and power efficiency compared to DDR.
  • 1Gbit Capacity (128M x 8): Provides a significant amount of memory for applications.
  • Clock Rate: 667MHz (DDR2-667): The -3S indicates a speed grade, specifying a maximum clock frequency of 333MHz (DDR2-667 effective).
  • 1.8V Power Supply: Operates at a standard DDR2 voltage of 1.8V.
  • Lead-Free Construction: Complies with RoHS environmental standards.
  • Double Data Rate Architecture: Transfers data on both the rising and falling edges of the clock signal.

Benefits:

  • High Bandwidth: Enables fast data transfer rates, improving system performance.
  • Large Capacity: Accommodates large datasets and complex applications.
  • Low Power Consumption: Contributes to energy efficiency, especially in portable devices.
  • Reliable Operation: Designed for stable and dependable performance.
  • Cost-Effective: Provides a balance of performance and cost for older systems.

Additional Details:

The HYB18T1G800CF-3S is typically packaged in a FBGA (Fine-Pitch Ball Grid Array) package. The specific temperature range and timings will be available in the device datasheet. Qimonda went bankrupt in 2009, so sourcing these modules may be difficult.

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