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MT51J256M32HF-60:B

Part No MT51J256M32HF-60:B
Manufacturer Micron Technology Inc.
Catalog DDR
Description GDDR5 256Mx32-60 6Gb/s (8Gb)
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Series *
Win Source Part Number 943801-MT51J256M32HF-60:B
Ultra Librarian 3D Model Ultra Librarian MT51J256M32HF-60:B CAD Model

Description

The MT51J256M32HF-60:B is a high-performance Hybrid Memory Cube (HMC) component manufactured by Micron Technology Inc. HMC is a revolutionary memory architecture that combines high bandwidth, low power consumption, and a compact form factor. This memory is ideal for high-performance computing, networking, and data center applications.

Applications

  • High-Performance Computing: Provides memory for demanding computations.
  • Networking Equipment: Enables high-speed data transfer in routers and switches.
  • Data Centers: Supports large-scale data processing and storage.
  • Graphics Processing Units (GPUs): Enhances graphics rendering and processing.
  • Scientific Simulations: Provides memory for complex simulations.

Features

  • Capacity: 256 Meg x 32 bits organization.
  • HMC Technology: High bandwidth, low power, and small size.
  • Data Rate: '-60' indicates a specific data transfer rate.
  • Operating Voltage: Operates at a low voltage for power efficiency.
  • Through-Silicon Vias (TSVs): Provides high-density vertical connections.
  • Advanced Memory Controller: Integrated controller optimizes performance.
  • Compact Form Factor: Designed for space-constrained applications.

Benefits

  • High Bandwidth: Enables extremely fast data transfer rates.
  • Low Power Consumption: Reduces energy usage and heat generation.
  • Reliability: Micron manufacturing ensures high quality and durability.
  • Compact Size: Suitable for dense system designs.
  • Improved System Performance: Enhances overall system speed.

Additional Details

The MT51J256M32HF-60:B is a cutting-edge memory solution designed for demanding applications. Its HMC architecture provides significantly higher bandwidth compared to traditional memory technologies. The use of Through-Silicon Vias (TSVs) enables high-density vertical connections, improving performance and reducing power consumption. The integrated memory controller optimizes data transfer and ensures efficient operation. The ':B' suffix may indicate a specific revision or manufacturing lot. This HMC is an excellent choice for systems requiring the highest levels of memory performance.

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Pricing & Ordering

Quantity Unit Price Ext. Price
3+ $26.0857 $78.2571
6+ $21.4045 $128.4270
9+ $20.7357 $186.6213
12+ $20.0670 $240.8040
15+ $19.3971 $290.9565
20+ $17.3908 $347.8160
!
Prices are subject to market and will be confirmed after the order is placed.
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
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Availability: 3,083 pieces
MOQ: 3 pcs
Order Increment : 1 pcs
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