The MT47H16M16FG-37E:B is a DDR2 SDRAM (Double Data Rate 2 Synchronous Dynamic Random-Access Memory) component from Micron Technology Inc. It is engineered to provide high-speed data access and is commonly found in applications requiring substantial memory bandwidth. This specific part is designed for various consumer and industrial applications.

Applications

• Desktop Computers
• Laptop Computers
• Graphics Cards
• Embedded Systems
• Networking Devices

Features

• Capacity: 16 Meg x 16 bits
• Data Rate: DDR2, which enhances bandwidth compared to standard DDR SDRAM.
• Clock Frequency: Determined by the -37E speed grade, defining the maximum operating clock frequency.
• Voltage: Operates at 1.8V, a typical voltage for DDR2 SDRAM, optimizing power consumption.
• Interface: Standard DDR2 interface ensures compatibility with a broad range of systems.
• Package: FBGA (Fine-pitch Ball Grid Array) package is used for efficient board assembly and thermal management.

Benefits

• Improved Bandwidth: DDR2 technology offers a significant increase in bandwidth compared to its predecessor, DDR SDRAM.
• Reduced Power Consumption: Operates at a lower voltage, leading to decreased power consumption and heat generation.
• Enhanced System Performance: Contributes to faster application loading, smoother multitasking, and improved overall system responsiveness.
• High Reliability: Manufactured by Micron, ensuring reliable and stable performance.
• Compatibility: Designed to be compatible with DDR2-supported systems and chipsets.

Additional Details

The MT47H16M16FG-37E:B complies with JEDEC standards for DDR2 SDRAM, ensuring interoperability and adherence to industry specifications. It incorporates features like prefetch buffers and internal pipelining to improve memory access efficiency. The device also includes power-saving modes to reduce power consumption during idle periods. The '-37E' indicates the speed grade, which specifies the maximum supported clock frequency and access time of the memory module. Matching the memory speed to the system's requirements is crucial for optimal performance. The FBGA package helps in efficient heat dissipation and allows for high-density board layouts.