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BZT52C3V3-W3

Part No BZT52C3V3-W3
Manufacturer MDD
Catalog OEM Parts (A - B)
Sample
Rohs State rohs
ECAD Module
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Win Source Part Number 982175-BZT52C3V3-W3
Categories OEM Parts(A-B)
Manufacturer MDD
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian BZT52C3V3-W3 CAD Model

Description

The BZT52C3V3-W3 is a Zener diode manufactured by MDD. It's designed for voltage regulation and transient suppression in various electronic circuits. This diode belongs to the BZT52C series and is noted for its compact size and reliability. It provides a stable voltage reference, making it suitable for space-constrained applications.

Applications:

  • Voltage regulation in portable devices
  • Transient voltage suppression in consumer electronics
  • Overvoltage protection in power supplies
  • Clipping and clamping circuits
  • Reverse polarity protection

Features:

  • Surface-mount package
  • Low leakage current
  • High surge current capability
  • Zener voltage of 3.3V
  • Pb-free and RoHS compliant

Benefits:

  • Provides a stable voltage reference for sensitive electronic components.
  • Protects circuits from voltage spikes and transients, enhancing reliability.
  • Small form factor allows for use in compact designs.
  • Reduces the risk of component damage due to overvoltage conditions.
  • Environmentally friendly due to Pb-free and RoHS compliance.

Additional Details:

The BZT52C3V3-W3 features a power dissipation rating that is typically 500mW. Its operating temperature range generally spans from -65°C to +150°C. Commonly found in applications demanding accurate voltage regulation, it's utilized in devices like mobile phones, tablets, and other portable electronics. The surface-mount package is designed for automated assembly, contributing to lower manufacturing expenses. The diode's swift response to voltage transients renders it appropriate for safeguarding delicate integrated circuits from potential harm. Device markings, essential for identification, are often laser-etched onto the package surface.

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