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EP2AGZ350FF35I3N

Part No EP2AGZ350FF35I3N
Manufacturer Intel
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 554 I/O 1152FBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Manufacturer Intel
Packaging Tray
Number of LABs/CLBs 13940
Number of Logic Elements/Cells 348500
Total RAM Bits 21270528
Number of I/O 554
Supply Voltage (V) 0.87V ~ 0.93V
Mounting Style SMD
Temperature Range - Operating -40°C ~ 100°C
Manufacturer Package 1152-BBGA, FCBGA
Supplier Device Package 1152-FBGA (35x35)
Part Number Series EP2AGZ350
Manufacturer Pack Quantity 24
MSL Level 3 (168 Hours)
Popularity Low
Supply and Demand Status Limited
Win Source Part Number 812097-EP2AGZ350FF35I3N
Ultra Librarian 3D Model Ultra Librarian EP2AGZ350FF35I3N CAD Model

Description

The Intel 812097-EP2AGZ350FF35I3N is a device package with 1152-FBGA (35x35) and 1152-BBGA, FCBGA.

  • Popularity: Low
  • Supply and Demand Status: Limited
  • Manufacturer Pack Quantity: 24
  • MSL Level: 3 (168 hours)
  • Mounting Style: SMD
  • I/Os: 554
  • LABs/CLBs: 13940
  • Logic Elements/Cells: 348500
  • Total RAM Bit: 21270528
  • Part Number Series: EP2AGZ350

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