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Same model may have multiple batches, images only for reference.
CY7C2262XV18-366BZXC Real Image
Same model may have multiple batches, images only for reference.

CY7C2262XV18-366BZXC

Part No CY7C2262XV18-366BZXC
Manufacturer Infineon Technologies
Catalog Memory
Description IC SRAM 36MBIT PAR 165FBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs) - Memory - Memory
Mfr Infineon Technologies
Package Tray
Product Status Active
Programmable Not Verified
Memory Type Volatile
Memory Format SRAM
Technology SRAM - Synchronous, QDR II+
Memory Size 36Mbit
Memory Organization 2M x 18
Memory Interface Parallel
Clock Frequency 366 MHz
Voltage - Supply 1.7V ~ 1.9V
Temperature Range - Operating 0°C ~ 70°C (TA)
Mounting Type Surface Mount
Package / Case 165-LBGA
Supplier Device Package 165-FBGA (13x15)
Base Product Number CY7C2262
Standard Package 680 pcs
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B2A
HTSUS 8542.32.0041
Win Source Part Number 916461-CY7C2262XV18-366BZXC
Ultra Librarian 3D Model Ultra Librarian CY7C2262XV18-366BZXC CAD Model

Description

The CY7C2262XV18-366BZXC is a 36Mbit SRAM memory chip designed for use in electronic devices.

  • Voltage Supply: 1.7V to 1.9V
  • Clock Frequency: 366 MHz
  • Memory Type: Volatile
  • Memory Size: 2M x 18
  • Mounting: Surface mount package
  • Package Size: 165-LBGA
  • Memory Interface: Parallel
  • Temperature Range: 0°C to 70°C
  • Manufacturer: Infineon Technologies
  • Status: Currently active.

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