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H5TQ2G83GFR-PBC

Part No H5TQ2G83GFR-PBC
Manufacturer Hynix Semiconductor
Catalog DDR
Description DDR3-1600 256Mx8 (2Gb)
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 941172-H5TQ2G83GFR-PBC
Series *
Ultra Librarian 3D Model Ultra Librarian H5TQ2G83GFR-PBC CAD Model

Description

The Hynix H5TQ2G83GFR-PBC is a 2Gb (Gigabit) DDR3 SDRAM (Synchronous Dynamic Random-Access Memory) component. It's designed for use in applications requiring a balance of memory capacity and performance, making it suitable for integration into embedded systems, network devices, and a variety of consumer electronics.

Applications:

  • Embedded Systems: Used as primary memory in embedded controllers and industrial automation equipment.
  • Network Devices: Employed in routers, switches, and modems for buffering data and managing network traffic.
  • Consumer Electronics: Memory for set-top boxes, media players, smart TVs, and other multimedia devices.
  • Industrial Computers: RAM for industrial PCs and single-board computers utilized in manufacturing and automation.

Features:

  • Capacity: 2Gb (Gigabit) DDR3 SDRAM.
  • Organization: Typically organized as 256M x 8.
  • Interface: Industry-standard DDR3 interface, ensuring broad compatibility with various chipsets and systems.
  • Operating Voltage: Operates at 1.5V, offering a balance between performance and power efficiency.
  • Data Transfer Rate: Supports high data transfer rates, enhancing overall system responsiveness.
  • Clock Frequency: Compatible with various clock speeds, allowing for flexible system configuration options.
  • Package: Available in a FBGA (Fine-Pitch Ball Grid Array) package for efficient board mounting and space-saving design.
  • RoHS Compliance: Manufactured to meet RoHS standards for environmental safety and lead-free production.

Benefits:

  • Reliable Performance: Provides stable and dependable memory operation in a variety of operating conditions.
  • Low Power Consumption: Efficient voltage operation minimizes energy usage and heat generation, improving system efficiency.
  • Wide Compatibility: DDR3 interface ensures compatibility with a broad range of systems and devices, simplifying integration.
  • Compact Design: FBGA package enables space-efficient integration in embedded applications and consumer electronics.
  • Enhanced Responsiveness: High data transfer rates contribute to faster application loading and improved multitasking capabilities.

Additional Details:

The H5TQ2G83GFR-PBC adheres to JEDEC standards for DDR3 SDRAM, guaranteeing interoperability and consistent performance across different platforms. It incorporates features such as on-die termination (ODT) and prefetch buffering to optimize data transfer and maintain signal integrity, resulting in improved system stability and performance. This memory component provides a reliable and efficient solution for a diverse array of applications in embedded systems, network devices, and consumer electronics, making it a valuable asset for enhancing system performance in diverse computing environments.

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