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H5TQ1G63BFR-PAC-C

Part No H5TQ1G63BFR-PAC-C
Manufacturer Hynix Semiconductor
Catalog DDR
Description DDR3-1600 64Mx16 (1Gb)
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 941515-H5TQ1G63BFR-PAC-C
Series *
Ultra Librarian 3D Model Ultra Librarian H5TQ1G63BFR-PAC-C CAD Model

Description

The Hynix H5TQ1G63BFR-PAC-C is a DDR3 SDRAM (Synchronous Dynamic Random Access Memory) component, providing memory capacity and bandwidth for various applications. Manufactured by Hynix Semiconductor, it is designed for use in systems where memory performance is a key factor.

Applications

  • Embedded Systems: Provides memory for devices like routers, switches, and other network appliances.
  • Industrial Automation: Used in control systems and data acquisition equipment.
  • Medical Devices: Employed in medical imaging and diagnostic equipment.
  • Automotive Applications: Integrated into automotive control systems and infotainment systems.
  • Consumer Electronics: Used in devices such as set-top boxes and smart TVs.

Features

  • 1Gb Density: Offers a memory capacity of 1 Gigabit in a single chip.
  • DDR3 Technology: Delivers high-speed data transfer rates, improving system performance.
  • FBGA Package: Uses a fine-pitch ball grid array for efficient board mounting and thermal dissipation.
  • Operating Temperature Range: Designed to operate reliably within a specified temperature range.
  • Low Power Consumption: Optimized for low power operation.

Benefits

  • Improved System Performance: Enables faster data processing and improved responsiveness in applications.
  • Enhanced Reliability: Designed for stable and reliable operation in various environments.
  • Increased Bandwidth: Supports high data transfer rates for demanding applications.
  • Lower Power Consumption: Reduces energy consumption and heat generation.
  • Compact Design: Allows for integration into smaller devices and systems.

Additional Details

The H5TQ1G63BFR-PAC-C operates at voltage levels defined by the DDR3 standard. Timing parameters, which are critical for system stability and performance, are configured by the system's memory controller or BIOS. The chip's internal architecture facilitates parallel data access to increase throughput. The 'PAC-C' speed grade indicates a specific performance level within the DDR3 specification. Refer to the official Hynix datasheet for comprehensive technical information including voltage specifications, timing parameters, and thermal characteristics.

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