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H5PS2G43AFR-Y5-C

Part No H5PS2G43AFR-Y5-C
Manufacturer Hynix Semiconductor
Catalog DDR
Description DDR2-667 512Mx4 (2Gb)
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 942010-H5PS2G43AFR-Y5-C
Series *
Ultra Librarian 3D Model Ultra Librarian H5PS2G43AFR-Y5-C CAD Model

Description

The Hynix H5PS2G43AFR-Y5-C is a 2Gb DDR2 SDRAM (Double Data Rate Synchronous Dynamic Random-Access Memory) component. It is designed for applications that demand high memory bandwidth and low latency, such as graphics processing, embedded systems, and high-performance computing. This memory chip provides a balance of capacity, speed, and power efficiency, making it suitable for a variety of applications.

Applications:

  • Graphics Cards
  • Embedded Systems
  • High-Performance Computing
  • Networking Equipment
  • Digital Video Processing

Features:

  • Capacity: 2Gb (256M x 8)
  • Interface: DDR2 SDRAM
  • Clock Frequency: Specified by the speed grade (Y5-C) - typically up to 533 MHz (1066 MHz effective)
  • Voltage: 1.8V
  • Data Rate: Up to 1066 Mbps
  • Operating Temperature Range: Commercial
  • Package: FBGA (Fine-pitch Ball Grid Array)
  • Double data rate architecture: Increases data transfer rates
  • On-chip DLL (Delay-Locked Loop): Ensures data integrity
  • Write latency = Read latency - 1 clock cycle
  • Burst Length: 4 or 8

Benefits:

  • Increased Bandwidth: High data transfer speeds improve system performance.
  • Reduced Latency: Enables quicker access to data, enhancing responsiveness.
  • Power Efficiency: Low voltage operation reduces power consumption.
  • Reliable Performance: Stable operation in diverse environments.
  • Compact Footprint: FBGA package allows for high-density board designs.

Additional Details:

The H5PS2G43AFR-Y5-C leverages a DDR2 architecture to achieve high bandwidth by transferring data on both the rising and falling edges of the clock signal. The on-chip DLL ensures accurate data timing, which is essential for maintaining data integrity at high speeds. This memory chip is packaged in a FBGA, which offers excellent thermal performance and allows for dense board layouts. It's a suitable choice for applications requiring high-speed and reliable memory access.

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