The DF12(3.0)-30DS-0.5V(86) is a 30-position, single-row, 0.5mm pitch board-to-board connector from Hirose Electric Co Ltd's DF12 series. It's designed for high-density mounting and high-speed data transmission applications, making it ideal for compact electronic devices.

Applications

• Smartphones
• Tablets
• Digital cameras
• Laptop computers
• Wearable devices

Features

• Fine Pitch: 0.5mm pitch enables high-density mounting on PCBs.
• Single-Row Configuration: Allows for narrow board widths.
• Board-to-Board Connection: Facilitates direct connection between PCBs without cables.
• Surface Mount Technology (SMT): Designed for automated assembly processes.
• High-Speed Data Transmission: Supports high data transfer rates.
• Secure Locking Mechanism: Ensures a reliable connection even under vibration.

Benefits

• Space Saving: Ultra-compact design allows for miniaturization of electronic devices.
• High-Speed Performance: Supports fast data transfer, enhancing system performance.
• Reliable Connection: Secure locking mechanism prevents accidental disconnection.
• Easy Assembly: SMT design facilitates automated assembly, reducing manufacturing costs.
• Durable: Robust construction ensures long-term reliability.

Specifications

The DF12(3.0)-30DS-0.5V(86) connector features a current rating of 0.5A and a voltage rating of 50V AC/DC. It has a contact resistance of 80 mΩ maximum and an insulation resistance of 100 MΩ minimum. The operating temperature range is -30°C to +85°C. The mating height is 3.0 mm. It's made from high-temperature resistant plastic suitable for reflow soldering processes.