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MB15U37SLBPFT

Part No MB15U37SLBPFT
Manufacturer Fujitsu Electronics America, Inc.
Catalog OEM Parts (M - N)
Description Contact for details
Sample
Rohs State Need to verify
ECAD Module
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RoHS Non-Compliant
Win Source Part Number 1075941-MB15U37SLBPFT
Categories OEM Parts(M-N)
Manufacturer Fujitsu Electronics America, Inc.
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian MB15U37SLBPFT CAD Model

Description

The MB15U37SLBPFT is a high-performance, low-power fractional-N frequency synthesizer designed by Fujitsu Electronics America, Inc. It is primarily intended for use in various wireless communication systems and applications. This synthesizer offers excellent phase noise performance and frequency agility, making it suitable for demanding applications.

Applications

  • Wireless LAN (WLAN) devices
  • Wireless communication systems
  • Satellite communication equipment
  • Cable TV tuners
  • Instrumentation and measurement equipment

Features

  • Fractional-N synthesizer
  • Low phase noise
  • Wide frequency range
  • High frequency resolution
  • Low power consumption
  • Integrated VCO
  • Serial programming interface
  • Small package size

Benefits

  • Enables high-performance wireless communication systems
  • Reduces system power consumption
  • Simplifies system design
  • Provides flexibility in frequency selection
  • Improves overall system performance
  • Reduces BOM cost

Additional Details

The MB15U37SLBPFT typically operates from a single supply voltage. The exact frequency range and other detailed specifications are generally available in the product datasheet. The fractional-N architecture allows for fine frequency resolution, which is crucial in modern communication standards. The low phase noise characteristic contributes to a cleaner signal, improving the overall performance of the communication link. It incorporates a serial programming interface, usually SPI or I2C, for easy configuration and control. The integrated VCO further reduces the number of external components needed, simplifying the design process and lowering the bill of materials (BOM) cost. It's often found in compact, low-power devices where performance is critical. The package type is typically a small form factor suitable for surface mount technology.

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