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Same model may have multiple batches, images only for reference.
CY7C25682KV18-400BZXC Real Image
Same model may have multiple batches, images only for reference.

CY7C25682KV18-400BZXC

Part No CY7C25682KV18-400BZXC
Manufacturer Cypress Semiconductor Corp
Catalog Unclassified Memory
Description NO WARRANTY
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Categories Integrated Circuits (ICs)
Features SRAM - Synchronous, DDR II+ Memory IC 72Mb (4M x 18) Parallel 165-FBGA (13x15)
Manufacturer Cypress Semiconductor Corp
Package Tray
Operating Temperature Range 0°C ~ 70°C (TA)
Mounting Surface Mount
Package 165-LBGA
Case / Package 165-FBGA (13x15)
Family Name CY7C25682
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B2A
HTSUS 8542.32.0041
Other Part Number 2015-CY7C25682KV18-400BZXC, -CY7C25682KV18-400BZXC
Quantity per package 136
Popularity Medium
Supply and Demand Status Limited
Win Source Part Number 867761-CY7C25682KV18-400BZXC
Ultra Librarian 3D Model Ultra Librarian CY7C25682KV18-400BZXC CAD Model

Description

The IC is a 165-LBGA package with a synchronous, DDR II+ Memory IC 72Mb (4M x 18) Parallel 165-FBGA (13x15) feature.

  • Applications: automotive, consumer electronics, and industrial control systems
  • Operating Temperature Range: 0°C ~ 70°C (TA)
  • Packaging: tray
  • Description: high-performance, low-power, 8-bit CMOS microcontroller
  • Architecture: Cypress Semiconductor Enhanced 8051 architecture
  • Compatibility: industry-standard 8051 instruction set and pinout

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