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40-516-11

Part No 40-516-11
Manufacturer Aries Electronics
Catalog Sockets for ICs, Transistors
Description CONN IC DIP SOCKET ZIF 40POS GLD
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Type DIP, ZIF (ZIP)
Number of Positions or Pins (Grid) 40 (2 x 20)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 10.0µin (0.25µm)
Contact Material - Mating Beryllium Copper
Mounting Type Through Hole
Features Closed Frame
Termination Solder
Pitch - Post 0.100" (2.54mm)
Contact Finish - Post Gold
Contact Finish Thickness - Post 10.0µin (0.25µm)
Contact Material - Post Beryllium Copper
Housing Material Polyamide (PA46), Nylon 4/6, Glass Filled
Package Bulk
Supply and Demand Status Shortage
Win Source Part Number 1629933-40-516-11
Ultra Librarian 3D Model Ultra Librarian 40-516-11 CAD Model

Description

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Shipping Information

Shipped from HK warehouse
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