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Category Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Mfr AMD Xilinx
Series Zynq® UltraScale+™ MPSoC EV
Package Tray
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 600MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Temperature Range - Operating -40°C ~ 100°C (TJ)
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
Number of I/O 204
Base Product Number XCZU7
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1014498-XCZU7EV-2FBVB900I
Ultra Librarian 3D Model Ultra Librarian XCZU7EV-2FBVB900I CAD Model

Description

The Zynq® UltraScale+™ MPSoC EV from AMD Xilinx is a powerful embedded system on chip (SoC) that is ideal for a wide range of applications. This SoC has a quad ARM® Cortex®-A53 MPCore™ with CoreSight™, dual ARM® Cortex™-R5 with CoreSight™, and ARM Mali™-400 MP2 core processor.

  • Speed: 533MHz, 600MHz, 1.3GHz
  • RAM Size: 256KB
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG
  • Peripherals: DMA and WDT
  • I/Os: 204
  • Logic Cells: Zynq® UltraScale+™ FPGA with 504K+ logic cells
  • Package Type: Tray
  • Package Size: 900-BBGA, FCBGA
  • Temperature Range: -40°C ~ 100°C (TJ)
  • ECCN: 5A002A4 XIL

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Quantity Unit Price Ext. Price
1+ $1,674.2425 $1,674.2425
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Availability: 220 pieces
Order Increment : 1 piece
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