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Same model may have multiple batches, images only for reference.
XCKU3P-2FFVB676I Real Image
Same model may have multiple batches, images only for reference.

XCKU3P-2FFVB676I

Part No XCKU3P-2FFVB676I
Manufacturer Amd
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 280 I/O 676FCBGA  /  series Field Programmable Gate Array (FPGA) IC 280 31641600 355950 676-BBGA, FCBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded - FPGAs (Field Programmable Gate Array)
Mfr AMD Xilinx
Series Kintex® UltraScale+™
Package Tray
Number of LABs/CLBs 20340
Number of Logic Elements/Cells 355950
Total RAM Bits 31641600
Number of I/O 280
Voltage - Supply 0.825V ~ 0.876V
Mounting SMD (SMT)
Temperature Range - Operating -40°C ~ 100°C (TJ)
Package / Case 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)
Base Product Number XCKU3
MSL Level 4 (72 Hours)
ECCN 3A991D
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 998878-XCKU3P-2FFVB676I
Ultra Librarian 3D Model Ultra Librarian XCKU3P-2FFVB676I CAD Model

Description

The AMD Xilinx 998878-XCKU3P-2FFVB676I is a high-quality electronic component that belongs to the Kintex UltraScale+ series.

  • Package Type: Tray
  • Standard Package: 1
  • Mounting: SMD (SMT)
  • Number of I/O: 280
  • Number of LABs/CLBs: 20340
  • Number of Logic Elements/Cells: 355950
  • Total RAM Bits: 31641600
  • Voltage Supply: 0.825V ~ 0.876V
  • Package/Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • HTSUS: 8542.39.0001
  • ECCN: 3A991D

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1+ $134.3927 $134.3927
2+ $129.9129 $259.8258
3+ $116.4736 $349.4208
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