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HSMP-389L-TR1

Part No HSMP-389L-TR1
Manufacturer Agilent(Hewlett-Packard)
Catalog RF Diodes
Description Surface Mount RF PIN Switch Diodes
Sample
Rohs State rohs
ECAD Module
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Manufacturer Agilent(Hewlett-Packard)
Win Source Part Number 1181904-HSMP-389L-TR1
Manufacturer Homepage www.home.agilent.com
Popularity Medium
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian HSMP-389L-TR1 CAD Model

Description

The HSMP-389L-TR1 is a surface mount Schottky diode manufactured by Agilent (Hewlett-Packard). It is designed for use in a variety of radio frequency (RF) and microwave applications, including detectors, mixers, and switches. This diode is characterized by its low forward voltage, fast switching speed, and low capacitance, making it suitable for high-frequency applications where signal integrity is critical.

Applications:

  • RF Detectors
  • RF Mixers
  • RF Switches
  • Sampling Circuits
  • Frequency Multipliers
  • Wireless Communication Systems

Features:

  • Schottky Barrier Diode
  • Low Forward Voltage
  • Fast Switching Speed
  • Low Capacitance
  • Surface Mount Package
  • RoHS Compliant

Benefits:

  • High Performance: The HSMP-389L-TR1's low forward voltage and fast switching speed enable high-performance operation in RF and microwave circuits.
  • Low Signal Loss: The low capacitance minimizes signal loss at high frequencies.
  • Versatile: The diode can be used in a variety of RF applications.
  • Easy Integration: The surface mount package simplifies integration into RF circuits.
  • Environmental Compliance: RoHS compliance ensures that the diode meets environmental regulations.

Additional Details:

The HSMP-389L-TR1's Schottky barrier construction results in a lower forward voltage and faster switching speed compared to traditional PN junction diodes. The low forward voltage reduces power dissipation and improves efficiency in detector and mixer circuits. The fast switching speed allows for high-frequency operation in switching and sampling circuits. The low capacitance minimizes signal loss and distortion at high frequencies. The surface mount package allows for automated assembly and reduces board space requirements. Its characteristics make it suitable for RF designs.

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