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XC6SLX75-2FG484I

Part No XC6SLX75-2FG484I
Manufacturer Xilinx Inc.
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 280 I/O 484FBGA / Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 280 3170304 74637 484-BBGA
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded>FPGAs (Field Programmable Gate Array)
Manufacturer AMD Xilinx
Packaging Tray
Number of LABs/CLBs 5831
Number of Logic Elements/Cells 74637
Total RAM Bits 3170304
Number of I/O 280
Voltage - Supply 1.14V ~ 1.26V
Mounting Surface Mount
Temperature Range - Operating -40°C ~ 100°C (TJ)
Case / Package 484-BBGA
Supplier Device Package 484-FBGA (23x23)
Base Product Number XC6SLX75
RoHS Status RoHS non-compliant
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Standard Package 60
Win Source Part Number 1318071-XC6SLX75-2FG484I
Ultra Librarian 3D Model Ultra Librarian XC6SLX75-2FG484I CAD Model

Description

The Xilinx Spartan-6 XC6SLX75-2FG484I is a low-power FPGA (Field-Programmable Gate Array) designed for cost-sensitive applications requiring a balance of performance and power efficiency. It is part of the Spartan-6 family, which provides a good mix of features and affordability.

Applications

  • Industrial Control: Used in industrial automation systems, motor control, and programmable logic controllers (PLCs).
  • Automotive: Employed in automotive infotainment, driver assistance systems (ADAS), and body electronics.
  • Consumer Electronics: Integrated into digital TVs, set-top boxes, and gaming consoles.
  • Medical Devices: Utilized in medical imaging equipment and patient monitoring systems.
  • Communications: Applied in wireless communication systems and networking equipment.
  • Embedded Systems: Deployed in a wide range of embedded systems requiring programmable logic.

Features

  • Logic Cells: Contains 74,641 logic cells, providing a substantial capacity for implementing complex digital designs.
  • Block RAM: Offers 4,824 Kbits of block RAM for on-chip data storage, reducing the need for external memory access.
  • DSP Slices: Includes 180 DSP slices for high-performance digital signal processing.
  • Clock Management: Features integrated clock management tiles (DCMs) for precise clock generation and distribution.
  • Package: Available in a 484-pin fine-pitch ball grid array (FG484) package.
  • Operating Temperature: Industrial temperature range version, supporting -40°C to +100°C junction temperatures.

Benefits

  • Cost-Effective: Provides a cost-optimized solution for high-volume applications.
  • Low Power Consumption: Minimizes power consumption, suitable for battery-powered devices and energy-efficient designs.
  • Flexibility: Allows for custom hardware implementation of algorithms and protocols, providing flexibility in design.
  • Integration: Integrates multiple functions into a single device, reducing board space and system complexity.
  • Scalability: Part of the Spartan-6 family, offering scalability to meet varying application requirements.
  • Reduced Time to Market: Allows for rapid prototyping and deployment of designs, reducing time to market.

Additional Details

The XC6SLX75-2FG484I supports various I/O standards, including LVDS, LVTTL, and HSTL, enabling seamless integration with other system components. It is supported by Xilinx's ISE Design Suite, providing a comprehensive development environment for design entry, simulation, and implementation. The device also features built-in security features, such as bitstream encryption and authentication, to protect against unauthorized access and tampering. The Spartan-6 family is known for its balance of performance, power efficiency, and cost, making the XC6SLX75-2FG484I a reliable solution for a wide range of embedded applications.

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