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XC6VHX250T-2FFG1154I

Part No XC6VHX250T-2FFG1154I
Manufacturer Xilinx Inc.
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 320 I/O 1156FCBGA
Sample
Rohs State rohs
ECAD Module
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Categories Integrated Circuits (ICs)
Estimated Pruduction Lead Time 51 Weeks
Features series Field Programmable Gate Array (FPGA) IC 320 18579456 251904 1156-BBGA, FCBGA
Manufacturer Xilinx Inc.
Series Virtex®-6 HXT
Package Tray
Number of I/O 320
Operating Temperature Range -40°C ~ 100°C (TJ)
Mounting Surface Mount
Package 1156-BBGA, FCBGA
Case / Package 1156-FCBGA (35x35)
Family Name XC6VHX250
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Quantity per package 1
Popularity High
Supply and Demand Status Balance
Win Source Part Number 903852-XC6VHX250T-2FFG1154I
Ultra Librarian 3D Model Ultra Librarian XC6VHX250T-2FFG1154I CAD Model

Description

The XC6VHX250T-2FFG1154I is a high-performance Virtex-6 FPGA from Xilinx. This FPGA is designed for demanding applications requiring a blend of high-speed logic, memory, and signal processing capabilities. The Virtex-6 family is known for its advanced features such as integrated transceivers and power optimization.

Applications

  • Aerospace and Defense: Used in radar systems, signal processing, and image processing.
  • Wireless Communications: Employed in base stations and other communication infrastructure for signal processing and protocol implementation.
  • Medical Imaging: Utilized in high-resolution medical imaging equipment for data acquisition and image reconstruction.
  • High-Performance Computing: Found in servers and data centers for accelerating specific compute-intensive tasks.
  • Video Processing: Used in broadcast equipment, video transcoding, and video conferencing systems.

Features

  • Logic Cells: Contains a high number of logic cells for implementing complex digital circuits.
  • Block RAM: Features a significant amount of on-chip Block RAM for high-speed data storage.
  • DSP Slices: Integrated DSP slices enable efficient implementation of digital signal processing algorithms.
  • High-Speed Transceivers: Integrated high-speed transceivers for high-bandwidth data transmission.
  • Advanced I/O: Supports a wide range of I/O standards for interfacing with various external devices.
  • Power Management: Offers advanced power management features for minimizing power consumption.
  • FFG1154 Package: Offered in a 1154-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG1154) package.
  • -2 Speed Grade: Indicates a specific speed grade within the Virtex-6 family, allowing for performance optimization.

Benefits

  • High Performance: Provides high-speed logic and signal processing capabilities for demanding applications.
  • Flexibility: Programmable logic allows for customization and adaptation to specific application requirements.
  • Integration: Integrated Block RAM, DSP slices, and transceivers reduce the need for external components.
  • Low Power Consumption: Advanced power management features minimize power consumption.
  • Reduced Time-to-Market: Development tools and IP cores enable faster design and implementation.

Additional Details

The XC6VHX250T-2FFG1154I is fabricated using a 40nm process technology. It supports various memory interfaces, including DDR3. The device is supported by Xilinx's Vivado Design Suite for design entry, simulation, and implementation. It operates over a specific industrial temperature range, indicated by the 'I' in the part number. The Virtex-6 family also includes features such as partial reconfiguration, allowing sections of the FPGA to be reconfigured while other sections remain active. The device includes integrated PCI Express endpoint blocks.

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1+ $347.3628 $347.3628
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