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W25Q01JVZEIM

Part No W25Q01JVZEIM
Manufacturer Winbond Electronics
Catalog IT infrastructure Memory
Description 1Gb Serial SpiFlash (Dual Die) Dual/Quad
Sample
Rohs State rohs
ECAD Module
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Category IT infrastructure Memory
Win Source Part Number 1454401-W25Q01JVZEIM
Manufacturer Winbond Electronics
Package Tray
Product Status Active
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NOR
Memory Size 1Gbit
Memory Organization 128M x 8
Memory Interface SPI - Quad I/O, QPI, DTR
Clock Frequency 133MHz
Write Cycle Time - Word, Page 3.5ms
Access Time 7.5ns
Voltage - Supply 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA)
Grade -
Mounting Type Surface Mount
Package / Case 8-WDFN Exposed Pad
Supplier Device Package 8-WSON (8x6)
Ultra Librarian 3D Model Ultra Librarian W25Q01JVZEIM CAD Model

Description

The W25Q01JVZEIM from Winbond is a high-quality Serial SPI flash memory device that offers a large storage capacity of 1Gb, organized into two individual dies for improved performance and reliability. This flash memory supports both dual and quad SPI interfaces, allowing for high-speed data transfer rates that make it ideal for a wide range of applications, including digital cameras, smartphones, and high-performance PCs. The dual die architecture not only enhances the device's storage capacity but also improves its endurance and data retention capabilities. Furthermore, this flash memory incorporates advanced features such as hardware protection mechanisms, a flexible architecture for easy programming, and low power consumption, making it a highly efficient choice for designers looking to maximize their system's performance.

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