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TH58TEG8E2HBA8C

Part No TH58TEG8E2HBA8C
Manufacturer Toshiba Semiconductor and Storage
Catalog Flash
Description 256Gb, 24nm, eMLC, Toggle2
Sample
Rohs State rohs
ECAD Module
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RoHS Compliant
Win Source Part Number 1099239-TH58TEG8E2HBA8C
Categories Flash
Manufacturer Toshiba Semiconductor and Storage
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian TH58TEG8E2HBA8C CAD Model

Description

The TH58TEG8E2HBA8C is a 128GB NAND flash memory device manufactured by Toshiba Semiconductor and Storage. Similar to other NAND flash memory chips from Toshiba, this component likely uses multi-level cell (MLC) or triple-level cell (TLC) technology to achieve a high storage density. It's designed for applications where large storage capacity is important, such as solid-state drives and high-capacity storage devices.

Applications

  • Solid-state drives (SSDs) for laptops and desktops
  • High-capacity USB flash drives
  • Embedded storage in high-end smartphones and tablets
  • Portable storage devices
  • Data center storage

Features

  • 128GB storage capacity
  • Multi-level cell (MLC) or Triple-level cell (TLC) NAND flash technology (likely)
  • High storage density
  • Compact package size
  • Operating voltage: typically 3.3V or 1.8V (depending on specific configuration)

Benefits

  • Large storage capacity for demanding applications
  • Cost-effective storage solution compared to SLC NAND flash
  • Improved system performance compared to traditional HDDs
  • Enhanced durability and shock resistance compared to HDDs
  • Suitable for storing large files, applications, and operating systems

Additional Details

The TH58TEG8E2HBA8C is expected to offer competitive read and write speeds, although these will vary based on the NAND flash controller and the specific system implementation. Error correction codes (ECC) are crucial for maintaining data integrity and reliability due to the higher density of MLC or TLC NAND. Power consumption is an important consideration, particularly for mobile applications. The device's operating temperature range and other environmental specifications ensure reliable operation in various conditions. The interface protocol used for data transfer (e.g., ONFI, Toggle) is a critical aspect of the device's functionality. The specific package type influences its suitability for different board layouts and assembly processes. Detailed information regarding timing, electrical characteristics, and reliability can be found in the product datasheet.

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Pricing & Ordering

Quantity Unit Price Ext. Price
3+ $26.5893 $79.7679
6+ $21.8168 $130.9008
9+ $21.1353 $190.2177
12+ $20.4539 $245.4468
15+ $19.7724 $296.5860
20+ $17.7269 $354.5380
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Availability: 222 pieces
MOQ: 3 pcs
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