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TMS32C6415EGLZA6E3

Part No TMS32C6415EGLZA6E3
Manufacturer Texas Instruments
Catalog Embedded - DSP (Digital Signal Processors)
Description IC FIXED POINT DSP 532-FCBGA /
Sample
Rohs State Need to verify
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded - DSP (Digital Signal Processors)
Mfr Texas Instruments
Series TMS320C6414/15/16
Package Tray
Type Fixed Point
Interface Host Interface, McBSP, PCI, UTOPIA
Clock Rate 600MHz
Non-Volatile Memory External
On-Chip RAM 1.03MB
Voltage - I/O 3.30V
Voltage - Core 1.40V
Temperature Range - Operating -40°C ~ 105°C (TC)
Mounting SMD (SMT)
Package / Case 532-BFBGA, FCBGA
Supplier Device Package 532-FCBGA (23x23)
Base Product Number TMS32
RoHS Status RoHS non-compliant
MSL Level 4 (72 Hours)
REACH Status REACH Affected
ECCN 3A991A2
HTSUS 8542.31.0001
Other Names TEXTISTMS32C6415EGLZA6E3,2156-TMS32C6415EGLZA6E3
Standard Package 60
Win Source Part Number 1100494-TMS32C6415EGLZA6E3
Ultra Librarian 3D Model Ultra Librarian TMS32C6415EGLZA6E3 CAD Model

Description

The Texas Instruments TMS32C6415EGLZA6E3 is a high-performance, fixed-point digital signal processor (DSP) belonging to the TMS320C64x family. Engineered to handle complex digital signal processing tasks with efficiency and speed, this DSP is ideal for applications requiring intense mathematical computations, high data throughput, and real-time processing capabilities.

Key Features:

  • High-Speed Performance: The TMS32C6415EGLZA6E3 operates at a core frequency of up to 1 GHz, enabling rapid processing and quick execution of DSP algorithms.
  • Large On-Chip Memory: Equipped with 1MB of internal RAM, this DSP allows for efficient data management and reduces the need for external memory components.
  • Advanced Very-Long-Instruction-Word (VLIW) Architecture: This architecture allows the processor to execute multiple instructions in parallel, significantly boosting the computational speed and throughput.
  • Robust Peripheral Set: The device includes a variety of peripherals such as a multi-channel buffered serial port, host-port interface, and 10/100 Mb/s Ethernet MAC, providing versatile connectivity options.
  • High-Performance Integrated Interconnects: The TMS32C6415EGLZA6E3 features a high-bandwidth crossbar switch fabric that enhances data flow between the DSP core, peripherals, and external interfaces.

Applications:

The TMS32C6415EGLZA6E3 is designed to meet the demands of several advanced applications, including:

  • Telecommunications: Baseband processing, network infrastructure, and wireless communication systems.
  • Imaging: Medical imaging systems, digital cameras, and video surveillance.
  • Multimedia: Audio and video processing, digital media servers, and broadcasting equipment.
  • Industrial: Control systems, robotics, and process automation.

Package and Quality:

The DSP is available in a 532-BGA (Ball Grid Array) package, ensuring a compact footprint and reliable connectivity for embedded systems. Texas Instruments is known for its commitment to quality, and the TMS32C6415EGLZA6E3 is no exception, meeting stringent industry standards for performance and reliability.

With its powerful features and flexible capabilities, the Texas Instruments TMS32C6415EGLZA6E3 DSP is an excellent choice for developers looking to push the boundaries of digital signal processing in their products.

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