The SFMC-125-01-S-D-P-TR is a fine-pitch micro header from Samtec Inc., part of the SFMC series, engineered for high-density board-to-board connections. This surface mount connector is designed for automated assembly and provides reliable performance in compact electronic devices.

Applications

• Board-to-Board Connections: Used to connect PCBs in a variety of electronic devices.
• High-Density Interconnects: Ideal for applications where space is limited.
• Medical Devices: Suitable for medical equipment where compact and reliable connections are crucial.
• Industrial Automation: Employed in industrial control systems requiring robust connectivity.
• Data Acquisition Systems: Used in systems that require reliable data transmission between boards.

Features

• Fine Pitch: Allows for high-density connections.
• Surface Mount: Designed for automated assembly processes.
• Dual Row: Provides increased contact density.
• 25 Positions per Row: Offering a total of 50 contacts.
• Samtec Tiger Eye™ Contacts: Known for their reliability and durability.
• Pick and Place Pad: The 'P' designates a pick and place pad for automated assembly.
• Tape and Reel Packaging: The 'TR' designates tape and reel packaging.

Benefits

• Space Saving: The fine pitch allows for more components on the board.
• Reliable Connection: Tiger Eye™ contacts ensure a secure and durable connection.
• Easy Assembly: Surface mount design simplifies the assembly process, and Pick and Place pad assists automated assembly.
• High Density: Dual row configuration allows for a large number of connections in a small area.
• Automated Handling: Tape and Reel packaging.

Additional Details

The SFMC-125-01-S-D-P-TR connector uses high-quality materials to ensure long-term reliability and performance. The '01' likely refers to a specific plating option or design variation within the series. The 'S' indicates surface mount compatibility, and the 'D' stands for dual row configuration. Mates with FFSD, FFTP, and other compatible series from Samtec. The tape and reel packaging ('TR') is designed for high-volume automated assembly processes, reducing handling time and ensuring consistent placement on the PCB.