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Categories Discrete Semiconductor Products
Manufacturer ON Semiconductor
Packaging Reel
Diode Type Schottky
Voltage - DC Reverse (Vr) (Maximum) 30V
Current - Average Rectified (Io) 3A
Voltage - Forward (Vf) (Maximum) at If 500mV at 3A
Speed Fast Recovery = 200mA (Io)
Reverse Recovery Time (trr) 12.5ns
Current - Reverse Leakage at Vr 100μA at 30V
Capacitance at Vr, F 485pF at 0V, 1MHz
Mounting Style SMD
Manufacturer Package DO-214AD, SMAF
Supplier Device Package DO-214AD (SMAF)
Operating Temperature - Junction -55°C ~ 150°C
Manufacturer Pack Quantity 1
MSL Level 1 (Unlimited)
Win Source Part Number 1176121-FSV330AF
Manufacturer Homepage www.fairchildsemi.com
Popularity Medium
Supply and Demand Status Sufficient
Ultra Librarian 3D Model Ultra Librarian FSV330AF CAD Model

Description

The ON Semiconductor FSV330AF is a cutting-edge smart power module designed to deliver exceptional performance and reliability for a wide range of applications. This compact, integrated device is part of ON Semiconductor's portfolio of power solutions that combines IGBTs, diodes, and an array of additional components to provide a complete switching solution. It is particularly suited for driving small motors in applications such as home appliances, fans, and other low-power devices.

Key Features

  • Integrated Design: The FSV330AF smart power module integrates multiple components into a single package, reducing the footprint and simplifying the design of the overall system.
  • High-Efficiency IGBTs: The module includes advanced IGBTs that offer low conduction and switching losses, which translate into high efficiency and reduced heat generation.
  • Optimized Gate Drive: The built-in gate drive circuitry is optimized for the IGBTs, ensuring fast switching speeds and minimizing gate-drive losses.
  • Overcurrent Protection: The module comes with overcurrent protection features that safeguard the device and the system it is controlling from damage due to excessive current.
  • Thermal Management: Excellent thermal performance is achieved through the use of a highly thermally conductive substrate, which helps in dissipating heat efficiently.
  • Compact Package: The FSV330AF is available in a compact package, making it suitable for space-constrained applications.

Applications

  • Home Appliances
  • Fan Controllers
  • Pumps
  • Other small motor drives

Technical Specifications

  • Rated Current: Specified at a particular current level suitable for the target applications.
  • Switching Frequency: The module is designed to operate at a frequency that balances efficiency and performance.
  • Isolation Voltage: The high isolation voltage rating ensures safe operation, even in challenging electrical environments.

The ON Semiconductor FSV330AF smart power module is a testament to the company's commitment to providing innovative, high-quality power solutions that meet the evolving needs of the electronics industry. With its combination of performance, efficiency, and integration, the FSV330AF is an excellent choice for designers looking to optimize their motor control applications.

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