The Molex 43650-0400 is a Micro-Fit TPA single row header designed for wire-to-board applications where terminal position assurance (TPA) is critical. This 4-circuit header ensures that terminals are fully seated and locked in place, preventing accidental disconnections and ensuring reliable electrical contact. The compact design makes it suitable for high-density applications, and its robust construction guarantees long-term performance.

Applications:

• Consumer appliances
• Industrial controls
• Automotive electronics
• Medical devices
• Power supplies
• Telecommunications equipment
• Lighting systems

Features:

• Micro-Fit TPA Design: Ensures proper terminal seating and retention.
• Single Row Configuration: Compact design for space-constrained applications.
• 4 Circuits: Accommodates four individual wire connections.
• Through-Hole Termination: Provides a secure and reliable connection to the PCB.
• Positive Locking: Provides a secure connection between the header and receptacle.
• High-Temperature Thermoplastic Housing: Allows for use in reflow soldering processes.
• Polarization Feature: Prevents mismating, ensuring correct connections.

Benefits:

• Enhanced Reliability: The TPA feature ensures terminals are properly seated and retained, minimizing the risk of connection failures.
• Space Savings: The compact design allows for higher density packaging, reducing overall system size.
• Simplified Assembly: Through-hole termination simplifies the soldering process.
• Versatile Application: Suitable for a wide range of applications due to its compact size and robust design.
• Reduced Downtime: Secure connections minimize the risk of accidental disconnections, reducing downtime and maintenance costs.
• Error Prevention: Polarization feature prevents incorrect mating, protecting sensitive electronic components.

Additional Details:

The Molex 43650-0400 is designed to mate with Molex Micro-Fit TPA receptacles. It has a current rating of up to 5.0A per circuit. The housing material is high-temperature thermoplastic, compatible with reflow soldering processes. The TPA feature requires a secondary action to fully lock the terminals into the housing, providing an extra layer of security against accidental disconnections. It is RoHS compliant.